Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Server

A server and chassis technology, applied in the server field, can solve the problems of high server design and manufacturing costs, achieve high industrial utilization value, and reduce design and manufacturing costs

Inactive Publication Date: 2012-02-08
INVENTEC PUDONG TECH CORPOARTION +1
View PDF3 Cites 14 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the increasing demand for server functions and the increasing miniaturization of the volume, there are more and more demands for installing multiple motherboards in the same chassis, and the volume of each motherboard itself is getting smaller and smaller. On the one hand, it is required to realize the hot plug of the motherboard. On the other hand, it is required to lay out more parts on the motherboard in a limited space, which makes the design and manufacturing cost of the server remain high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Server
  • Server
  • Server

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0053] see figure 1 and 2 , is a partial exploded view of the internal structure of the server according to an embodiment of the present invention. As shown in the figure, the server 1 of this embodiment is at least composed of a chassis 11, a hard disk array 12, a plurality of motherboard modules 13, a power supply module 15, and an adapter board 16. The composition and connection relationship of the components will be described in detail belo...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a server which is provided with a hard disk array and a main board module which are respectively arranged at the front end and rear end of a case in a removable mode so that hot plug is realized in the server. The main board module is provided with a bearing plate for bearing a main board, an expansion rack for bearing an expansion card with a golden finger, and a cable for electrically connecting the main board and the expansion card; and the cable can prevent the signal of the main board from being distorted by the influence of the length of a transmission path. The main board can be in contact with the server for plugging the main board through the golden finger of the expansion card, so that the design and manufacturing costs of the server are reduced, i.e., the server can be used for effectively overcoming various defects in the prior art and has high industrial utilization value.

Description

technical field [0001] The invention relates to a server, in particular to a server realizing the function of hot plugging of the motherboard. Background technique [0002] With the development of electronic technology, servers have become widely used information processing systems in the industry. A server usually includes a motherboard, a power supply, various disk drives, etc., and the motherboard is the core part of the server. [0003] Due to the increasing demand for server functions and the increasing miniaturization of the volume, there are more and more demands for installing multiple motherboards in the same chassis, and the volume of each motherboard itself is getting smaller and smaller. On the one hand, it is required to realize the hot plug of the motherboard. On the other hand, it is required to lay out more parts on the motherboard in a limited space, which makes the design and manufacturing cost of the server remain high. [0004] Therefore, how to design ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/16G06F1/18
Inventor 王世锋徐继彭郑再魁
Owner INVENTEC PUDONG TECH CORPOARTION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products