Method for processing subsurface gate by discharging

Abstract

The invention relates to a method for processing a subsurface gate by discharging, comprising the following steps of: manufacturing a rough processing electrode and a fine processing electrode according to the shape of a gating port; using a turning machine to turn the rough processing electrode and the fine processing electrode; arranging an embedding piece on an electric discharge machine working platform and enabling the gating direction of the embedding piece to be vertical to the electric discharge machine working platform; finding the coordinates of X axis and Z axis of the gating port, using the rough processing electrode for rough processing to the position 0.4mm-0.6mm above the bottom of the gating port; and replacing the rough processing electrode with the fine processing electrode and carrying out fine processing till the required value is reached. By the method, the subsurface gate can be fast processed, and simultaneously the processing accuracy also can be guaranteed.

Description

technical field [0001] The invention relates to a processing method for a latent gate, in particular to a method for electric discharge machining a latent gate. Background technique [0002] Latent gate, also known as tunnel gate, is evolved from point gate. It not only overcomes the shortcomings of point gate mold complexity, but also maintains the advantages of point gate. The latent gate can be set on the side of the movable mold or on the side of the fixed mold. It can be placed on the inner surface or hidden side of the plastic part, it can also be placed on the ribs and columns of the plastic part, and it can also be placed on the parting surface. It is also a simple and easy way to use the ejector rod of the mold to set the gate. The latent gate is generally three-dimensional, and forms a certain angle with the cavity, usually 20°-45°, and the gate size can be selected according to the point gate size. [0003] The advantages of latent gates are as follows: (1) The...

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Problems solved by technology

(2) After the product is formed, it will be automatically broken with the plastic part when it is ejected

Its disadvantages are as follows: (1) Since the latent gate sneaks under the parting surface and enters the cavity along an oblique direction, it is difficult to process

(2) Since the shape of the gate is a cone, it is easy to cut off when ejecting, so the diameter should be relatively small, but when dealing with thin-walled products, it is not suitable because the pressure loss is too large and it is easy to condense.

[0004] At present, the latent gate is usually processed by forming drill, but the processing speed of forming drill is relatively fast, but its precision is not high, and it is impossible to realize those latent gates that require high precision.

In order to improve the machining accuracy, EDM is also used for machining. Although EDM can improve the machining accuracy, its speed is greatly slowed down.

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