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Film adhering method and device of wafer

A film sticking device and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as inability to adjust wafer support force, difficulty in adjusting roller pressure, affecting wafer quality, etc., to reduce damage The risk of the wafer front side, the reduction of the risk of re-filming, and the effect of high film bonding efficiency

Inactive Publication Date: 2011-06-22
上海技美科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the bubbles are formed, the cutting film must be removed and reapplied, which will not only cause waste of raw materials, but also increase the process and reduce production efficiency
[0008] 3. Wafers of different thicknesses can withstand different pressures
However, because the installation of the rollers and the table is relatively fixed, it is very difficult to adjust the pressure of the rollers; and the method in the prior art cannot adjust the supporting force to the wafer, especially when the contact area between the table and the wafer is relatively small. when
[0009] 4. The film attaching device in the prior art can only be applied to wafers of one size. When attaching films to wafers of different sizes, it is necessary to replace the table of the corresponding size, which increases the operation steps and reduces the production efficiency.
[0010] In addition, the method described above is not a non-contact film in the true sense
The wafer is in contact with the supporting device, even if the contact area is small, it will still affect the quality of the wafer and reduce the yield of the chip

Method used

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  • Film adhering method and device of wafer
  • Film adhering method and device of wafer
  • Film adhering method and device of wafer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] like figure 1 As shown, the wafer attaching device includes a base 1 . Four seat legs (two seat legs 121 , 122 are shown in the figure) are installed on the lower surface of the base 1 for supporting the base 1 . The upper surface 11 of the base 1 is provided with a first groove (not shown in the figure) for accommodating the first platform 2 .

[0051] like figure 1 As shown, the first disc 2 is circular. The upper surface 21 of the first table 2 is provided with multiple turns of first air holes 22 , and the number of turns can be determined according to the diameter of the first table 2 . The number of first air holes 22 in each circle is more than two, which are evenly distributed along the circumferential direction, and the specific number can be determined according to the circumference. The first air hole 22 extends from the upper surface of the first platform 2 to the lower surface. The first air holes 22 are all communicated with an air compressor (not sho...

Embodiment 2

[0055] Figure 4 It is a structural schematic diagram of Embodiment 2 of the present invention. like Figure 4 As shown, the wafer attaching device includes a base 1 , and four legs are installed on the lower surface of the base 1 for supporting the base 1 . Figure 4 Only two seat legs (121, 122) are shown in .

[0056] The upper surface 11 of the base 1 is provided with a first groove (not shown in the figure). The first groove is used for accommodating the first disc 2 . The structure and usage of the first platform 2 are the same as those in Embodiment 1. The size of the first disk 2 is equivalent to that of a 12-inch wafer. The edge of the 12-inch wafer can be adsorbed and fixed on the first platform 2 through the second air hole 23 . Compressed air can be blown between the 12-inch wafer and the first platform 2 through the first air hole 22 to provide support for the 12-inch wafer.

[0057] The upper surface 21 of the first platform 2 is provided with a second gro...

Embodiment 3

[0069] The difference between this embodiment and Embodiment 2 is that the first platen 2 and the air cylinder are not provided. The second table 3 is arranged in the first groove of the base 1 , and the size of the first groove is adapted to the diameter of the second table 3 . All the other structures are identical with embodiment 2.

[0070] This embodiment is only suitable for attaching films to wafers of one size, but both non-contact and contact film attachments can be used.

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Abstract

The invention discloses a film adhering method of a wafer. The film adhering method of the wafer is characterized by comprising the following steps of: blowing a gas between the wafer and a table disc; supporting the wafer by utilizing the blown gas; and then adhering a film on the surface of the wafer. By using the film adhering method and device of the wafer, the non-contact film adhesion can be realized and the danger of front surface damage of the wafer can be reduced; in addition, because the wafer can be supported by utilizing the gas during the pressing of a roller wheel, the pressure of the roller wheel can be offset, and the roller wheel can not be easy to press the wafer to be broken or crushed, therefore when the film adhering method and device are used for carrying out the non-contact film adhesion, the minimum thickness of the wafer which can be adhered with the film is 50 micrometers and 200 micrometers far less than that of the water adhered with the film in the prior art.

Description

technical field [0001] The invention relates to a method for attaching a film to a wafer and a device for attaching a film to a wafer. Background technique [0002] Usually, the circuit side of the wafer, that is, the side that completes the chip function, is called the front side, and the other side is the back side. During wafer processing, for various purposes, it is often necessary to stick a thin film on the surface of the wafer. There is a kind of film to protect the wafer when cutting the wafer, which is called dicing film, and the dicing film is attached to the back of the wafer. Some films play a protective role in other processes. A frame is required for wafer dicing, and the frame is a sheet with a through hole in the middle. The wafer is located in the through hole of the frame, and both are pasted on the same film. When attaching a dicing film to a wafer, it is necessary to attach the wafer and the frame to the dicing film together. The frame and the dicing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/00
Inventor 张明星
Owner 上海技美科技股份有限公司
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