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Packaging device for piezoelectric component

A technology for encapsulating devices and components, applied to electrical components, piezoelectric/electrostrictive/magnetostrictive devices, circuits, etc., can solve the problem of failure, poor operation of piezoelectric sheets, damaged or broken conductive wires, etc. problem, to achieve the effect of solving vibration, preventing vibration shock and avoiding loosening

Active Publication Date: 2011-05-25
MIDAS WEI TRADING +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the high-voltage pulse wave is input, the current is transmitted to the piezoelectric sheet through the conductive wire, which will cause the piezoelectric sheet to vibrate violently up, down, left, and right, and because the conductive wire is very thin, it is affected by the piezoelectric sheet. Intense vibration can easily damage or break the conductive wire, which will lead to poor operation or loss of function of the piezoelectric film

Method used

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  • Packaging device for piezoelectric component
  • Packaging device for piezoelectric component
  • Packaging device for piezoelectric component

Examples

Experimental program
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Embodiment Construction

[0047] Please also refer to figure 1 and figure 2 , are respectively a perspective view and a perspective exploded view of the present invention. exist figure 2 Among them, the piezoelectric component packaging device includes an upper cover 11 and a lower cover 12, a first hole 111 and a second hole 121 are respectively provided in the middle, and a first accommodating groove 112 and a first accommodating groove 112 and a The second accommodating groove 122 is used for accommodating the first conductive sheet 15 and the second conductive sheet 16 respectively. The first conductive sheet 15 and the second conductive sheet 16 are a conductive sheet, and the bending extensions of the first conductive sheet 15 and the second conductive sheet 16 are respectively a first cylindrical conductor 151 and a second cylindrical conductive Body 161. The inner edge of the upper cover 11 and the periphery of the first hole 111 are provided with a first groove 113 for embedding a ring-s...

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Abstract

The invention discloses a packaging device for a piezoelectric component. An upper cover and a lower cover correspondingly rotate to be clamped and fixed so as to form an accommodating space; a hole is formed in the middle of the upper cover and in the middle of the lower cover respectively; the inner edge of the upper cover and the inner edge of the lower cover are provided with a groove at the periphery of the hole respectively, and an annular elastomer is correspondingly embedded into the groove; the piezoelectric component is arranged in the accommodating space and between the elastomer of the upper cover and the elastomer of the lower cover; a conducting strip is arranged on the external surface of the upper cover and the external surface of the lower cover respectively; and a bent extending part of the conducting strip, such as a cylindrical conducting body passes through the hole in the middle of the upper cover, the hole in the middle of the lower cover, and the elastomers embedded into the grooves respectively, and is connected to nodes on the upper surface and lower surface of the piezoelectric component by welding, and reacting force which is applied to the grooves and the cylindrical conducting bodies by the elastomers is used to buffer upper, lower, left and right parts, so that a 360-degree anti-vibration effect is achieved.

Description

【Technical field】 [0001] The present invention relates to a piezoelectric component packaging device, in particular to a piezoelectric component packaging device that can prevent the piezoelectric component from being loosened and broken due to the vibration generated by the operation when the piezoelectric component is connected to the circuit. 【Background technique】 [0002] Press, the operation of the piezoelectric ceramic sheet (referred to as "piezoelectric sheet") is excited by the high-voltage pulse wave, and converts mechanical energy into electrical energy, which can be applied to power components, or can convert electrical energy into sound energy. It can be applied not only to the sound component (microphone) of the hands-free handset of the telephone, but also to ultrasonic technology and underwater image detection; also because the piezoelectric sheet will vibrate due to the effect of current conduction during operation, Therefore, there must be a very stable ci...

Claims

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Application Information

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IPC IPC(8): H01L41/053
Inventor 魏道金
Owner MIDAS WEI TRADING
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