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Characteristic inspection and classification apparatus for sheet-like electronic component

A technology for electronic components and sorting devices, which is applied in the direction of measuring devices, electrical components, circuits, etc., can solve the problems of rising pressure of the ejected gas, entering, and the inability to select and distinguish sheet electronic components, so as to prevent misclassification and high reliability Effect

Active Publication Date: 2011-05-11
HUMO LAB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to this high speed, when ejecting (injecting) chip electronic components from the storage hole to the sorting hole by the ejection gas, it is necessary to eject it strongly in a shorter time, so the pressure of the ejection gas increases.
Therefore, as the distance between the storage hole and the sorting hole becomes smaller, the chip electronic components cannot be selected and classified in advance, and may enter the sorting hole of other levels.
When items of other classes are mixed in due to misclassification, there will be consequences for the reliability of the equipment they are assembled into

Method used

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  • Characteristic inspection and classification apparatus for sheet-like electronic component
  • Characteristic inspection and classification apparatus for sheet-like electronic component
  • Characteristic inspection and classification apparatus for sheet-like electronic component

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The size of the chip electronic component (type 0603) that is the object of the chip electronic component characteristic inspection and classification device is 0.6 mm long x 0.3 mm wide x 0.3 mm thick, and the minimum value of the outer dimension is 0.3 mm.

[0030] refer to image 3 , Figure 4 , Figure 5 and Image 6 A characteristic inspection and classification device for chip electronic components corresponding to Embodiment 1 of the present invention will be described. image 3 is to zoom in figure 1 A top view of a portion of the bracket used for sorting, Figure 4 It is viewed from the direction of arrow A in the diagram image 3 A cross-sectional view of the classification bracket, Figure 5 yes Figure 4 An enlarged view of the portion of the sorting hole shown, Image 6 It is an enlarged view of a conventional sorting hole portion, and is a figure for explaining occurrence of misclassification.

[0031] Such as image 3 , Figure 4 and Figure 5...

Embodiment 2

[0043] When the object of the chip electronic component characteristic inspection and classification device is set as a chip electronic component (1005 type), the minimum value of its external dimension is 0.5mm, so it is possible to set a predetermined value smaller than the minimum external dimension of the chip electronic component The length is set to 0.4 mm, for example.

Embodiment 3

[0045] When the object of the chip electronic component characteristic inspection and classification device is set as a chip electronic component (0402 type), the minimum value of its external dimension is 0.2mm, so it can be scheduled The length is set to 0.15 mm, for example.

[0046] Various modifications can be made within the scope of the present invention to the embodiments described in detail above. For example, a predetermined length smaller than the minimum value of the outer dimension of the chip electronic component may be selected according to the situation within the regulations. In addition, as clearly explained above, the effect of the present invention is also effective for chip-like electronic components having external dimensions other than the examples. At this time, what can be said for all the target chip electronic components is that the tip of the chip electronic component in the housing hole 101 of the target chip electronic component described in the ...

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PUM

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Abstract

The invention provides a characteristic inspection and classification apparatus for sheet-like electronic components, which comprises a classification part equipped with a an electrical characteristic for inspecting sheet-like electronic components and capable of classifying electronic components based on the inspection result. The classification part comprises a circular disc (1), a standard station (6) and a sorting bracket (5). A plurality of accommodation holes for delivering a sheet-like electronic component (7) are arranged at equal intervals on a plurality of concentric circles of the circular disc (1). The standard station (6) is equipped with ejection holes (601) for classifying the sheet-like electronic component (7) corresponding to the plurality of accommodation holes. The sorting bracket (5) is assembled with a plurality of sorting holes (501) and a launching tube (503) connected with the sorting hole (501). The front peripheries of the sorting holes (501) are concentrically provided with flexible tubes (502). The distance between the mobile surface at the sorting bracket (5) of the circular disc (1) and the front end of the flexible tubes (502) is maintained to be smaller than that of the minimum value of the dimension of the sheet-like electronic component (7).

Description

technical field [0001] The present invention relates to a technology for preventing misclassification in a chip electronic component characteristic inspection and sorting device that inspects electrical characteristics of chip electronic components and performs classification based on the inspection results. Background technique [0002] In recent years, the production volume of chip electronic components such as chip capacitors incorporated in liquid crystal televisions, mobile phones, game machines, etc. has been increasing. In order to ensure the reliability of the above-mentioned equipment, all chip electronic components are inspected, and the throughput of a chip electronic component characteristic inspection and sorting device for inspection is required to increase the speed of multi-column processing (Patent Document 1). [0003] Patent Document 1: Japanese National Publication No. 2000-501174 [0004] As described above, all chip electronic components are inspected,...

Claims

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Application Information

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IPC IPC(8): B07C5/344B07C5/36H01G13/00
CPCB07C5/344B07C5/36G01R31/016H01G13/00
Inventor 山本哲矢
Owner HUMO LAB
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