Method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards

Abstract

The invention discloses a method for classifying and compensating nonlinear variation of core boards for manufacturing multilayer circuit boards, which comprises the following steps of: A. classifying factors affecting the deformation of core board materials; B. designing a test pattern on an inner negative film; C. measuring the distance of the test pattern on the inner negative film; D. transferring the test pattern on the inner negative film to an inner core board; E. blackening and browning multiple layers of circuit boards; F. laminating the circuit boards, and measuring the distance of the test pattern on the inner core board after the lamination; G. calculating the expansion and shrinkage distance of the inner core board of the multilayer circuit boards; H. creating a compensation database in accordance with the classification of the step A, and optimizing the design dimension of the inner core board of the multilayer circuit boards. By using the technical scheme described in the invention, problems of deviation between layers and out-of-tolerance of expansion and shrinkage dimension appear during the lamination of the multilayer circuit boards can be solved, the dimension accuracy of the finished product and alignment accuracy between core board layers are improved, and the reliability of the product is improved.

Description

technical field [0001] The present invention relates to a multilayer PCB (Printed Circuit Board, printed circuit board, printed circuit board) board size change classification compensation method, especially relates to a multilayer printed circuit board in the lamination manufacturing process of layer deviation and size increase A classification compensation method for the non-linear change of the core plate size caused by the over-shrinkage deviation. Background technique [0002] The manufacturing process of multilayer printed circuit boards generally includes: material cutting → inner layer production → blackening / browning → lamination → subsequent processes. In the manufacturing process of multilayer printed circuit boards, it is generally a process of laminating multiple core boards, prepregs and copper foils under high temperature and high pressure conditions in the lamination process. After lamination of multi-layer circuit boards, the core board generally shrinks in...

AI Technical Summary

Problems solved by technology

[0008] The invention provides a classification compensation method for the non-linear change of core board size in the manufacture of multi-layer circuit boards. During the laminated manufacturing process of the printed circuit board, there are problems of layer deviation and size expansion and contraction.

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