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Compact electromagnetic band gap structure for avoiding high-speed circuit noise

An electromagnetic bandgap structure, circuit noise technology, applied in circuits, electrical components, waveguide-type devices, etc., can solve problems such as the impact of high-speed circuit signal integrity, power supply or ground plane division, etc.

Active Publication Date: 2014-04-09
BEIHANG UNIV
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  • Abstract
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Problems solved by technology

And the electromagnetic bandgap structure that has been studied seriously divides the power supply or ground plane, which will have a serious impact on the signal integrity of high-speed circuits

Method used

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  • Compact electromagnetic band gap structure for avoiding high-speed circuit noise
  • Compact electromagnetic band gap structure for avoiding high-speed circuit noise
  • Compact electromagnetic band gap structure for avoiding high-speed circuit noise

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Embodiment Construction

[0052] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0053] The present invention is a compact electromagnetic band gap structure for solving high-speed circuit noise, and proposes a new type of compact electromagnetic band gap structure. The structure designs the terminal of the electromagnetic band gap structure unit into an S shape, which can make the structure coupling The electromagnetic band gap generated can suppress high frequency and ultra high frequency power noise. The coplanar compact electromagnetic band gap structure is composed of an electromagnetic band gap structure unit periodically extending on a plane.

[0054] The electromagnetic bandgap structure simulation calculation model in the present invention is composed of a power layer, a dielectric layer and a ground layer, and the positional connection relationship between them is as follows image 3 : Among them, 1 is the power layer on the top laye...

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Abstract

The invention relates to a compact electromagnetic band gap structure for avoiding high-speed circuit noise, which is a coplanar compact electromagnetic band gap structure, is etched on a whole power metal plane by utilizing a laser etching process, and is a periodic structure. The shape of a periodic unit is as follows: four sides of the periodic structure are all connected with rectangular metal glue of an arc-shaped connecting bridge, and all the periodic units are connected by the arc-shaped connecting bridge at each side of each periodic unit; the response of the compact electromagnetic band gap structure is determined by three parameters, i.e. the head end of a stop band, the bandwidth of the stop band and the reachable isolation in the stop band; the compact electromagnetic band gap structure is designed in two steps: first, a dispersion map is calculated by a single table cell; and second, an S parameter is calculated. The invention improves the power supply area of a power plane, simultaneously inhibits the high-frequency and super high-frequency part of power noise of a power supply system, and has practical value and wide application prospect in the technical field of high-speed circuits.

Description

(1) Technical field [0001] The invention relates to a compact electromagnetic band gap structure for solving high-speed circuit noise. The compact electromagnetic band gap structure can suppress high-frequency and ultra-high frequency power noise of a high-speed circuit power distribution system. The invention belongs to the field of high-speed circuits. (2) Background technology [0002] With the development of electronic products to miniaturization and high integration, the structure of the power distribution system of electronic products has also changed to support the increasing speed of the system. The initial power distribution system was a discrete power feeder, and then developed to discrete power ground traces, then power ground filling and division, and finally developed into today's planar power bus structure of multi-layer high-speed circuits. The purpose of the high-speed circuit power distribution system is to provide the voltage and current required by the transis...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F17/50H01P1/20
Inventor 阎照文王涛姜英杰车明明韩雅静王刚
Owner BEIHANG UNIV
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