Thin film forming method and film forming apparatus

Abstract

Provided is a method for forming a thin film by depositing on a substrate (21) particles sputtered in vacuum from a film forming source (27). Specifically, the particles are deposited on the substrate (21) in a state where a movable endless strip (11) is arranged between the film forming source (27) and the substrate (21) so that a film forming region (DA) is defined on a surface of the substrate (21) by the movable endless strip (11) of which the approach route and the return route are set between the film forming source (27) and the substrate (21). The substrate (21) is typically a long substrate having flexibility. The particles are deposited on the substrate (21) while the substrate is being transferred from a feeding roller (23) to a take-up roller (26).

Description

technical field [0001] The invention relates to a thin film forming method and a film forming device. Background technique [0002] Currently, thin-film technologies are being widely developed to support higher performance and miniaturization of equipment. The thin film of equipment not only brings direct advantages to users, but also plays an important role from the environmental point of view such as the protection of earth resources and the reduction of power consumption. [0003] Generally, in vacuum film formation, a film formation source is opposed to a substrate, and a film formation region on the surface of the substrate is defined by a mask. There is also a technique of depositing on the substrate only the particles incident on the substrate at a specific angle range among the particles flying from the film formation source. [0004] In order to increase the productivity of the thin film, a long-time film-forming technique is necessary. In order to achieve long-t...

AI Technical Summary

Problems solved by technology

Films cannot be fabricated as designed when the film-forming area varies

Images