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Test method for detecting reliability of product

A test method and reliability technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve problems such as long test cycles, and achieve the effect of increasing sturdiness and reliability, shortening the time-to-market, and increasing product reliability

Active Publication Date: 2010-12-01
BEIJING SHENGTAOPING TEST ENG TECH RES INST
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Problems solved by technology

Common reliability testing methods for electronic products generally use traditional temperature and humidity chambers with different performances to verify and improve the reliability performance of products during research and development; traditional testing methods for aging life (ie high temperature, etc.) are used in online production. It usually takes a long test period, and there are still some difficulties in achieving high-quality technical indicators of electronic products only relying on the above-mentioned traditional testing methods

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Embodiment Construction

[0027] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0028] combine figure 1 , the test method for detecting product reliability of the present embodiment includes successively carrying out temperature step stress test, rapid temperature change stress test, vibration step stress test, temperature and vibration comprehensive test for the product to be tested, and in the above-mentioned each test process and After each test, the product under test is tested for function.

[0029] Among them, the specific steps of the temperature step stress test are as follows:

[0030] Temperature step stress includes low temperature step stress test and high temperature step stress test:

[0031] (1) Low temperature step stress test: the ...

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Abstract

The invention discloses a test method for detecting reliability of a electronic product, and the method comprises the following steps: sequentially carrying out temperature step stress test, rapid temperature change stress test, vibration step stress test and temperature and vibration comprehensive test on the product to be detected, and carrying out the functional detection on the product to be detected. The test method can rapidly find out the defects in the design and the manufacture of the product, improve the design defects, increase the reliability of the product and shorten the period of coming into the market; simultaneously, the test method can set up basic data for design capacity and the product reliability, so as to be used as an important basis for the further research and the development.

Description

technical field [0001] The invention relates to the field of reliability, in particular to a test method for detecting product reliability. Background technique [0002] Many of today's products are required to operate for thousands of hours without failure under extremely severe environmental stresses, so testing is required to confirm design flaws or verify expected lifetimes. [0003] The ultimate stress test is a type of highly accelerated stress test (IIAST, highly accelerated stresstest), which specifies a method for determining or evaluating the maximum capabilities of microelectronic devices, including absolute maximum ratings (from which safe design limits can be deduced), The maximum stress that can be applied during screening or testing without degradation, the susceptibility to specific screening or testing without degradation, and the failure modes and mechanisms associated therewith. [0004] With the rapid development of electronic technology, the test method...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/30
Inventor 王群勇阳辉陈冬梅吴文章白桦陈晓孙旭朋陈宇
Owner BEIJING SHENGTAOPING TEST ENG TECH RES INST
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