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Turnover testing module and testing system thereof

A test module and test system technology, which is applied to the testing of machine/structural components, measuring devices, instruments, etc., and can solve the problems of general products without suitable structure and inconvenience.

Active Publication Date: 2010-09-29
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] This shows that above-mentioned existing test system obviously still has inconvenience and defect in structure and use, and urgently needs to be further improved
In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but for a long time no suitable design has been developed, and the general product has no suitable structure to solve the above-mentioned problems. This is obviously the relevant industry. Urgent problem

Method used

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  • Turnover testing module and testing system thereof
  • Turnover testing module and testing system thereof
  • Turnover testing module and testing system thereof

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Embodiment Construction

[0052] In order to further explain the technical means and effects that the present invention takes to achieve the intended purpose of the invention, the specific implementation, structure, and characteristics of the flip test module and its test system proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. And its effect, detailed description is as follows.

[0053] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of preferred embodiments with reference to the drawings. For convenience of description, in the following embodiments, the same elements are denoted by the same numbers.

[0054] figure 1 The system block diagram of FIG. 2 shows a flip test system 1 according to an embodiment of the present invention, which is used to test the flip motion of a packaged motion sensor (motio...

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Abstract

The invention relates to a turnover testing module and a testing system thereof. The turnover testing module comprises at least one accommodating device such as a slot used for temporarily accommodating a tested assembly and also comprises a turnover mechanism used for turning over one or more axial turnovers. The turnover testing module combines a handler and a tester to form a turnover testing system, wherein the handler is used for picking up and placing the tested assembly to the turnover testing module, and the tester is used for respectively controlling the turnover testing module and the handler. Via the modularized design, the turnover testing module can be integrated into a traditional testing system and can be elastically replaced with other motion testing modules. The inventionnot only can reduce the cost and simplify the design, but also can increase the testing elasticity and the diversity so as to be beneficial to improving the testing capacity.

Description

technical field [0001] The invention relates to a test system, in particular to a flip test module suitable for a motion sensor (motion sensor) and a test system thereof. Background technique [0002] A motion sensor (or dynamic sensor) is a component that can convert a motion state (such as a tilt angle) into a corresponding electronic signal, which is gradually widely used in modern electronic or electromechanical devices, such as game controllers, Mobile phones, digital music players (MP3), cameras, personal digital assistants (PDAs) that implement various motion (e.g. flip, acceleration, rotation, etc.) related applications to promote authenticity, convenience or functionality in use diversity. [0003] Today's motion sensors are generally manufactured as integrated circuits by combining semiconductor process technology with electromechanical technology (such as micro-electro-mechanical system (MEMS) technology). Like a general integrated circuit, a final test (final t...

Claims

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Application Information

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IPC IPC(8): G01M19/00G01D5/12G01M99/00
Inventor 倪建青徐培伦赖茂德
Owner KING YUAN ELECTRONICS
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