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Method, device and system for chamber pressure control

A chamber pressure and control method technology, applied in the field of control, can solve problems such as complicated installation, high price, and non-pressure control method, and achieve the effect of cost saving

Active Publication Date: 2010-06-09
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of this pressure control valve is relatively expensive and the installation is relatively complicated, so this technical solution is not an ideal pressure control method

Method used

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  • Method, device and system for chamber pressure control
  • Method, device and system for chamber pressure control
  • Method, device and system for chamber pressure control

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Embodiment Construction

[0028] In order to enable those skilled in the art to better understand the technical solution of the present invention, the chamber pressure control method / device provided by the present invention and the chamber pressure control system applying the above method and / or device will be described in detail below with reference to the accompanying drawings .

[0029] see figure 1 , the chamber pressure control method provided by the present invention controls the chamber pressure by means of a mass flow controller arranged on the gas delivery pipeline of the chamber and keeps it within the target pressure range, which mainly includes the following steps:

[0030] Step 100, according to the corresponding relationship between the chamber pressure and the gas delivery flow, obtain the gas delivery target flow that can maintain the chamber within the target pressure range.

[0031] Step 200, setting the target flow rate of gas delivery as the flow setting value of the mass flow cont...

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Abstract

The invention provides a chamber pressure control method, which comprises: step 100, acquiring air delivery target flow required when a chamber is in a target pressure according to a corresponding relationship between the pressure of the chamber and the air delivery flow; and step 200, setting the air delivery target flow as a flow setting value of a mass flow controller, wherein the mass flow controller implements air delivery operation on the chamber based on the flow setting value and controls the pressure of the chamber within the target pressure range. The method for controlling the pressure of the chamber also comprises a step of acquiring the corresponding relationship between the pressure of the chamber and the air delivery flow. In addition, the invention also provides a chamber pressure control device, a chamber pressure control system using the method and the chamber pressure control system using the device. An expensive pressure control valve is replaced by adopting the cheaper mass flow controller and the simple control step, and the cost of the process / equipment is saved while effectively controlling the pressure of the chamber.

Description

technical field [0001] The present invention relates to the field of control technology, in particular, to a chamber pressure control method, a chamber pressure control device, a control system using the above pressure control method, and a control system using the above pressure control device. Background technique [0002] With the rapid development of electronic technology, people have higher and higher requirements for the integration of integrated circuits, which requires companies that produce integrated circuits to continuously improve the processing capabilities of semiconductor devices. At present, enterprises widely use plasma processing equipment to process / treat semiconductor devices. The so-called plasma refers to the ionization of the process gas under the excitation of radio frequency power to form active particles containing a large number of electrons, ions, excited atoms, molecules and free radicals. In practical applications, the process gas can be excite...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D16/20G05D16/14H01L21/00
Inventor 张京华刘畅
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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