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Method for detecting corrosiveness of electronic-equipment application environment, and corresponding electronic equipment

A technology of electronic equipment and detection method, applied in the direction of weather resistance/light resistance/corrosion resistance, measuring device, instrument, etc., can solve the problem of not being able to take countermeasures in time, and achieve the effect of simple structure, promising application prospect and low cost

Active Publication Date: 2010-03-10
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

More importantly, the existing detection equipment generally does not conduct real-time detection of the corrosiveness of the environment in which the electronic equipment is used, and the detection results at certain points in time cannot fully reflect the state changes of the environment in which the electronic equipment is used; in the corrosive state of the environment When there is a significant deterioration, there is a risk that countermeasures cannot be taken in time

Method used

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  • Method for detecting corrosiveness of electronic-equipment application environment, and corresponding electronic equipment
  • Method for detecting corrosiveness of electronic-equipment application environment, and corresponding electronic equipment
  • Method for detecting corrosiveness of electronic-equipment application environment, and corresponding electronic equipment

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Embodiment Construction

[0039] For ease of description, the terms used in the embodiments of the present invention are first explained:

[0040] The Board Management Controller (BMC) is a dedicated service processor that uses sensors to monitor the status of a computer, network server, or other hardware-driven device, and manages it through an independent connection line and system staff to communicate.

[0041] The BMC is part of the Intelligent Platform Management Interface (IPMI) and is usually included on the motherboard or the main circuit board of the device being monitored.

[0042]The BMC's sensors can be used to measure internal physical variables such as temperature, humidity, supply voltage, fan speed, communication parameters and operating system (OS) functions. If any of these variables are out of bounds, the BMC notifies the administrator. Administrators can then use the remote control to take corrective action by power cycling the monitored equipment or restarting it if necessary. T...

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PUM

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Abstract

The invention discloses a method for detecting corrosiveness of electronic-equipment application environment. The method comprises: detecting the corrosion condition of a probe component in real timeto acquire a to-be-compared corrosion value of the probe component, wherein the to-be-compared corrosion value is used to represent the corrosion degree of the probe component; the probe component isarranged in the application environment of electronic equipment; and the corrosion resistance of a material used by the probe component is less than or equal to that of electronic-element solder in the electronic equipment; comparing the to-be-compared corrosion value with a preset corrosion threshold to get a result of corrosion-degree comparison; and generating a prompt message for representingthat corrosion events occur in the application environment of the electronic equipment when the result of corrosion-degree comparison shows that the to-be-compared corrosion value is greater than or equal to the preset corrosion threshold. By detecting the corrosion events in the application environment of the electronic equipment in real time, the method is easy to take corresponding measures forpreventing system faults. The invention also provides the corresponding electronic equipment.

Description

technical field [0001] The invention relates to the field of corrosion resistance detection of test materials, in particular to an electronic device corresponding to a method for detecting the corrosion of the environment in which the electronic device is used. Background technique [0002] In order to meet the requirements of the environmental directive ROHS (the Restriction of the use of certain hazardous substances in electrical and electronic equipment, the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment), it is imperative to use lead-free soldering in the electronics manufacturing industry. Compared with traditional Sn-Pb soldering, lead-free soldering is a developing technology: on the one hand, lead-free solder has the characteristics of high soldering temperature, strong corrosion, and easy oxidation; on the other hand, the surface brightness of lead-free solder joints decreases ; As a result, lead-free soldering puts for...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N17/00
Inventor 王军
Owner LENOVO (BEIJING) LTD
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