LTCC lamination microstrip patch antenna

Abstract

The invention discloses an LTCC-stacked microstrip patch antenna, pertains to the antenna technical field and relates to the LTCC (low temperature co-fired ceramic) technology, in particular to a low profile microstrip patch antenna applied to receiving radio. The microstrip patch antenna comprises three layers of LTCC substrates: the first layer of substrate is provided with a coaxial feeding hole, the upper surface thereof is a first radiation metal patch and the lower surface thereof is a reflection plate; the second layer of substrate is evenly provided with air holes; and the upper surface of the third layer of substrate is a second radiation metal patch. In addition, the microstrip patch antenna also comprises a coaxial feeding needle which is inserted into the coaxial feeding hole from the bottom to be connected with the first radiation metal patch on the first layer of substrate and be insulated with the reflection plate. The first, second and third layers of LTCC substrates form an integrity after passing through an LTCC stack and isostatic pressing technology from the bottom up and co-fire is carried out to the integrity at low temperature so as to form another integrity. The microstrip patch antenna can effectively widen the band width of a microstrip antenna, intensify the coupling between two radiation patches and improve the stability and reliability of the antenna.

Description

technical field [0001] The invention belongs to the technical field of antennas, and relates to low-temperature co-fired ceramic (LTCC) technology, in particular to a low-profile microstrip patch antenna for radio reception. Background technique [0002] Microstrip patch antennas have many advantages such as small size, light weight, thin profile, and easy conformality, and are widely used in wireless communication, remote sensing, aerospace and other fields. However, the narrow working bandwidth of the microstrip patch antenna has also become the bottleneck of its further development. The current microstrip patch antennas generally use organic dielectric materials or ceramic materials as substrates. In order to expand the bandwidth of microstrip patch antennas, common methods include increasing the thickness of the substrate, reducing the dielectric constant of the substrate, adopting a multi-layer structure, and adding impedance. match etc. But these methods are all at t...

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Problems solved by technology

[0004] At present, due to the late start of the research and design of LTCC antennas, compared with LTCC chip inductors, capacitors, filters and other passive chip devices, the design and manufacture of antennas based on LTCC is still in its infancy. There are reports and patent applications for microstrip antennas with multi-layer structures, but there are no reports on LTCC stacked low-profile, broadband microstrip patch antennas.

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