Circuit board element mounting/welding quality detection method and system based on super-resolution image reconstruction

Abstract

The invention relates to a circuit-board element installing / welding quality detection method based on super-resolution image reconstruction. The method comprises the steps of utilizing a camera array and the motion of a conveyor belt to perform super-resolution image reconstruction on an area to be detected of a circuit board, and judging whether the installation and welding of elements are qualified according to reconstructed high-resolution images of the area to be detected on the circuit board. A detection system for realizing the method consists of a central server and a plurality of super-resolution detection ends, wherein the central server is connected with every super-resolution detection end; the super-resolution detection ends acquire the images of the area to be detected of the circuit board at detection points, perform super-resolution image reconstruction and then transmit the images to the central server; and the central server matches every high-resolution image in the area to be detected of the circuit board, which is acquired at the detection points, with a corresponding standard template, so as to detect unqualified elements or welding spots.

Description

Technical field [0001] The invention relates to a method and system for detecting the production quality of a circuit board, in particular to a method and system for detecting the mounting / welding quality of circuit board components based on super-resolution image reconstruction. Background technique [0002] With the development and wide application of electronic technology, the demand for electronic products is increasing, and the requirements for their manufacturing processes are also increasing. For many electronic product manufacturers, how to conduct accurate and efficient detection and timely correction of quality problems in the production process of electronic products, reduce the rate of defective products, and ensure the quality of the manufactured products, not only can save production costs, but also It directly affects the company's brand and reputation, is related to the survival of the company, and is the core competitiveness of the company. Among them, the inspec...

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a circuit board component installation / soldering quality inspection method based on super-resolution image reconstruction to solve the disadvantages of high cost and slow speed when reducing the area of ​​the shooting area when using high-resolution imaging equipment in the current automatic optical inspection , this method uses the camera array and the movement of the conveyor belt to perform super-resolution image reconstruction on the area to be inspected on the circuit board, and judges whether the components are installed and soldered according to the reconstructed high-resolution image of the area to be inspected on the circuit board

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