Method of preparing electronic device case
An electronic device and manufacturing method technology, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, layered products, etc., can solve the problems of diffusion or volatilization, affecting the aesthetics of graphics, and smudged edges of graphics on the shell, etc. Simplify the manufacturing process, omit the paint baking process, and avoid the effect of edge stains
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[0017] see figure 1 , shows an electronic device case 10 according to a preferred embodiment of the present invention, the case 10 includes a thin film layer 12 and a base body 14, the thin film layer 12 and the base body 14 are integrally formed and the thin film layer 12 is positioned on the base body 14 The outer layer, the film layer 12 is used to decorate the surface of the housing 10.
[0018] see figure 2 , the thickness of the film layer 12 is relatively thin, it has high temperature resistance, and its melting point is higher than the melting point of the material of the substrate 14, and can be selected from materials such as plastics, glass, ceramics, alloys, etc., which can be formed as transparent or The outer layer of the housing 10 is non-transparent. A pattern 122 is printed on the film layer 12 .
[0019] The base 12 constitutes the main component of the housing 10, which is selected from more common injection molding resins, such as: polyvinyl chloride, p...
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