Method for manufacturing electrolytic capacitor and electrolytic capacitor

Abstract

The invention provides an electrolytic capacitor with soft solder of excellent heat tolerance and longevity. The invention also provides a method for manufacturing an electrolytic capacitor comprising the steps of: forming a capacitor element having a pair of electrode foils wound with a separator interposed therebetween; impregnating the capacitor element with a dispersion solution containing particles of an electrically conductive solid or aggregates thereof and a solvent to form a planar electrically conductive solid layer having the particles of the electrically conductive solid or the aggregates thereof on the surfaces of the electrode foils and the separator; and impregnating the capacitor element having the electrically conductive solid layer with an electrolytic solution.

Description

technical field [0001] The present invention relates to an electrolytic capacitor, and more specifically, to an electrolytic capacitor having a capacitor element in which a pair of electrode foils composed of an anode foil and a cathode foil are wound through a separator. Background technique [0002] With the digitization of electronic devices, capacitors used therein are increasingly required to be small in size, large in capacity, and small in equivalent series resistance (hereinafter referred to as ESR) in a high-frequency region. [0003] In order to reduce the ESR in the high-frequency region, as the electrolyte, conductive materials such as polypyrrole, polythiophene, or their derivatives are known to be used for conductive materials such as polypyrrole, polythiophene, or their derivatives. A solid electrolytic capacitor as a cathode material (for example, Patent Document 1). [0004] On the other hand, from the viewpoint of increasing the capacity, there is a capaci...

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Problems solved by technology

[0010] However, in the method of forming a conductive solid layer in a capacitor element as described above, since an oxidizing agent is attached to the anode foil and oxidative polymerization proceeds on the dielectric coating, the dielectric coating is easily damaged, and the conductive solid Layers tend to form unevenly on the surface of electrode foils and separators

Therefore, the heat resistance of the solder in the mounting process is poor, and the deterioration of the characteristics during long-term use becomes remarkable.

In addition, in the method described above, after oxidative polymerization, it is necessary to remove unreacted polymerizable monomers or oxidizing agents by washing, so there is also a problem that the process becomes complicated.

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