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Memory body IC detecting and sorting machine

A memory and sorter technology, applied in the field of memory IC detection and sorting machines, can solve the problems of simple functionality, long standby time, and reduced memory IC detection efficiency, so as to shorten the operation time, improve the use efficiency, The effect of increasing the number of detections

Inactive Publication Date: 2009-01-14
HON TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, because the memory IC is purely used to store data, its functionality is relatively simple, so it is generally tested with multiple memory ICs at the same time; , it cannot transfer and test multiple memory ICs to be tested at the same time, and only a single memory IC to be tested is carried at a time through the transfer device, which will make the entire material transfer standby time too long. If there are multiple The large-scale memory IC testing machine of the test device, the operation and waiting time of each device will be more cumbersome and time-consuming, and the detection efficiency of the memory IC will be greatly reduced. Therefore, an IC testing and sorting machine is not suitable for executing memory IC detection work

Method used

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  • Memory body IC detecting and sorting machine

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Embodiment Construction

[0029] Referring to Fig. 3, the memory IC detection and sorting machine of the present invention is provided with a feeding box 21, a plurality of material receiving boxes 22A, 22B, 22C at the front end of the machine platform 20, and a testing device 23, 24. The positioning device 25 located between the two testing devices 23, 24, and the material shifting device 26 that moves between the feeding and receiving boxes 21, 22A, 22B, 22C and the testing devices 23, 24; the described feeding box 21 is used to bear the memory IC to be tested, and a plurality of receiving boxes 22A, 22B, 22C can be subdivided into different grades, and are used to store different grades of memory ICs that have been tested; the testing devices 23 and 24 are There are test circuit boards 232, 242 with a plurality of test sockets 231, 241 (Open Top Socket), and the test circuit boards 232, 242 are connected to the testing machine (not shown) below the machine table 20. The testing machine is also The t...

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Abstract

The invention relates to a memory IC testing and classifying device, comprising a feeding box which is arranged on a machine platform to support the memory IC to be tested; a receiving box which is arranged on the machine platform to support the tested memory IC; a testing device which is arranged on the machine platform, and provided with a plurality of testing sheath seats in parallel; a material moving device which is arranged on the machine platform, and provided with a jack jig and a plurality of taking and placing heads to transfer a plurality of memory ICs tested or to be tested among the feeding box, the testing device and the receiving box; a central processor which is used to control and integrate the movement of each device to execute automatic operation. Thereby, a plurality of memory ICs can be transferred and tested synchronously, the stand-by time is effectively shortened, the testing efficiency of the memory IC is largely improved, and the service efficiency and the use benefits of the efficiency are achieved and improved.

Description

technical field [0001] The invention relates to an IC detection and classification machine, in particular to a memory IC detection and classification machine. Background technique [0002] Nowadays, the ICs of semiconductor components are roughly divided into different types such as logic ICs, memory ICs, analog ICs, and micro-component ICs. Taking logic ICs as an example, they are central processing units used on motherboards, responsible for central processing units and The signal conversion or transmission of other peripheral components, as well as the calculation operation, have more complex functions, while the memory IC is simply used to store data and installed on the module circuit board, and the module circuit board is then assembled on the host computer. On the board, its functionality is relatively simple, but no matter what type of IC, after the production is completed, it must go through a test operation to eliminate defective products and ensure product quality...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B07C5/344B07C5/38G01R31/28
Inventor 谢旼达
Owner HON TECH INC
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