Ultraviolet laser machining apparatus for cutting wafer

Abstract

The invention relates to a design method for ultraviolet laser processing equipment used in the wafer cutting; lasers emitted by an ultraviolet laser are injected to a laser transmission system which can vertically inject focus spots with high energy density to a processing platform; the laser energy distribution focused on the surface of the processing platform is controlled by adjusting opticalcomponents in the laser transmission system; the wafer that is about to be processed is positioned and the cutting tracks are planned by an optical image system before the laser cutting; a laser optical axis keeps still and the processing platform carries out the linear motions along an X axis and a Y axis during the laser processing; an industrial computer conveys control instructions to the laser while the laser conveys state information to the industrial computer, and the optical image system transmits the taken image information of the work piece surface to the industrial computer to carry out the image processing. The design method adopts an optical path design with simple and complete functions, controls the spot energy distribution of the laser processing platform conveniently and flexibly and can be applied to the semi-conductor wafer sheet cutting of a plurality of materials and specifications.

Description

technical field [0001] The invention relates to a laser cutting device, in particular to a high-precision ultraviolet laser processing device used for semiconductor wafer cutting. Background technique [0002] Semiconductor wafers are often grown on substrate materials with similar crystal lattices by vapor deposition. Before semiconductor devices are packaged in terminal applications, wafers of several inches need to be cut into smaller sized grains. Traditional wafer cutting is processed by mechanical methods such as grinding wheels and diamond knives. However, the mechanical processing method has the disadvantages of slow processing speed and wide cutting line. Especially when cutting hard substrates like sapphire, the mechanical cutting efficiency is low. The cost is high. Cutting a 2-inch wafer is generally 1 to 2 pieces per hour, and each diamond blade can only cut 2 to 3 pieces. [0003] With the development of the semiconductor industry, there are more and more type...

AI Technical Summary

Problems solved by technology

Traditional wafer cutting is processed by mechanical methods such as grinding wheels and diamond knives. However, the mechanical processing method has the disadvantages of slow processing speed and wide cutting line. Especially when cutting hard substrates like sapphire, the mechanical cutting efficiency is low. The cost is high, cutting a 2-inch wafer is generally 1-2 pieces per hour, and each diamond blade can only cut 2-3 pieces

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