Experimental device for utilizing semiconductor refrigeration

A kind of experimental device, semiconductor technology, applied in the direction of measuring device, machine/structural component test, instrument, etc., can solve the problems of unsatisfactory temperature control accuracy, unsatisfactory working environment, temperature error, etc., to improve the working environment conditions , low noise, and the effect of improving the accuracy of the experiment

Inactive Publication Date: 2008-11-26
张雪波
View PDF0 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the widespread use of air compressors to provide cold air, the existing products have the following main disadvantages: First, the temperature control accuracy is not satisfactory, and the temperature error is generally above 1°C
Second, the noise is loud and the working environment is not ideal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Experimental device for utilizing semiconductor refrigeration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0008] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0009] like figure 1 As shown, the present invention includes a box body 1 on which a control box 11 is arranged. In the box body 1, the experimental cabin is surrounded by the experimental bulkhead board 2 and the experimental cabin bottom plate 5. Several layers of sample partitions 3 are arranged in the experimental cabin. The circulating ventilation channel 4 is located between the experimental bulkhead plate 2 and the inner wall of the box.

[0010] A heating wire 6 and a semiconductor refrigerator 7 are installed below the bottom plate 8 of the experimental cabin. A fan 8 driven by a motor 9 is installed on one side of the heating wire 6 and the semiconductor refrigerator 7 . The humidifier 10 is installed on one side of the box body 1 and is an ultrasonic humidifier.

[0011] The method of use of the invention is as follows:

[001...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention provides an experimental device which uses semiconductor refrigeration, comprising a box body (1), which is internally provided with an experimental cabin which is enclosed by a wall plate (2) and a bottom plate (5) of the experimental cabin, and a semiconductor refrigerator (7), which is arranged below the bottom plate (8) of the experimental cabin. The errors of temperatures of a whole machine are controlled within 0.5 DEG C, which improves the experimental accuracy. On the other hand, the experimental device produces lower noise when working and improves the working environments. The experimental device also has the advantages of low energy consumption and convenient use and operation.

Description

technical field [0001] The invention relates to an experimental device utilizing semiconductor refrigeration. Background technique [0002] The main function of the experimental device using semiconductor refrigeration is to provide an environment with constant temperature and humidity for scientific experiments such as sample analysis. Existing experimental devices using semiconductor refrigeration use electric heating wires combined with air compressors to adjust the temperature. When the temperature in the box needs to be increased, the heating wires are controlled to work, and when the temperature needs to be lowered, the air compression is started. The air compressor is installed in the box to provide cold air for the experimental cabin. Due to the widespread use of air compressors to provide cold air, the existing products have the following main disadvantages: First, the temperature control accuracy is not satisfactory, and the temperature error is generally above 1°...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G01M19/00G01M99/00
Inventor 张雪波
Owner 张雪波
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap