Method and device for simulating boundary current influencing seepage flow
A water supply device and water flow technology, which is applied in the direction of measuring devices, instruments, scientific instruments, etc., can solve problems affecting bank slope seepage, etc., and achieve the effect of easy implementation, simple operation, and simple principle
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
example
[0021] Example: The inner diameter of the two-flow action chamber is 30cm, and the inner cavity length is 30cm. The water head difference H provided by the water supply tank w = 150cm. The ring column sample adopts uniform sand with a particle size range of 0.2-0.3mm, the average particle size is 0.25mm, and the sample length is 30cm, the outer diameter is 20cm, and the inner diameter is 4.7cm. The diameter of the water circulation pipe is the same as the diameter of the intermediate flow pipe in the ring column sample. During the test, the water temperature of the water supply pool was monitored all the time, it was about 27°C, and the change of water temperature was within 1°C. Through the flow-seepage coupling test of different tangential boundary flow conditions and different combinations of seepage head differences, the test results show that the tangential boundary flow has a significant influence on seepage, and it changes regularly.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com