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Tool for filling glue of power module and filling method

A power module and glue filling technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems that the heat dissipation film and the module cannot be tightly combined, the components are arranged differently, and the heat dissipation effect is not very ideal.

Inactive Publication Date: 2008-09-10
ASTEC POWER SUPPLY (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The heat dissipation of the power module to ensure its normal operation has always been a problem that needs to be solved. At present, the best way to solve the heat dissipation problem is to lay on or around the module A film with good thermal conductivity is used to dissipate heat, but the power module has no shell, and the components are arranged in different heights. The heat dissipation film and the module cannot be tightly combined, and the heat dissipation effect is not very ideal.

Method used

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  • Tool for filling glue of power module and filling method
  • Tool for filling glue of power module and filling method

Examples

Experimental program
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Embodiment Construction

[0021] Such as figure 1 , 2 As shown, a tool for filling glue to the power module includes a filling box and a glue-limiting mold 11 that can seal the inner space of the power module. The filling box is composed of a box body 10 and a box cover 3 that is fastened to it. The top of the body 10 is provided with a sealing strip 5. After the box cover 3 is fastened, the filling box is sealed. The filling box body 10 communicates with the vacuum generator 8. The glue-limiting mold 11 is placed in the filling box body 10, and the glue-limiting mold 11 is connected with a glue filling device, the glue filling device includes a glue filling funnel 17, the filling box cover 3 is provided with a glue filling port 18, the glue filling funnel 17 is inserted into the glue filling port 18, and the glue limiting mold 11 cooperates with the power module The detachable housing that seals the space between the two PCB boards of the power module, the glue-limiting mold 11 includes a bottom plat...

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PUM

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Abstract

The invention discloses a tool used for filling rubber into a power module and a rubber filling method thereof, wherein, the tool for filling rubber comprises a filling box and a rubber limiting mould that can seal the inner space of the power module, the filling box is communicated with a vacuum generator, the rubber limiting mould is put in the filling box and connected with a rubber filling device. The rubber filling method for a power module is that: in vacuum condition, the heat-conducting rubber is pumped and filled between two PCB plates of the power module. The tool used for filling rubber into a power module, which is clean, convenient and practical, can fill the heat-conducting rubber between the two PCB plates of the power module. The rubber filling method for a power module is simple, and fast and has good filing effect.

Description

technical field [0001] The invention belongs to the technical field of power supply heat dissipation, and relates to a tool and a glue filling method for a power supply module. Background technique [0002] The heat dissipation of the power module to ensure its normal operation has always been a problem that needs to be solved. At present, the best way to solve the heat dissipation problem is to lay a film with good thermal conductivity on or around the module to dissipate heat. However, the power module has no shell, and the element Due to the different arrangement of devices, the heat dissipation film and the module cannot be tightly combined, and the heat dissipation effect is not very satisfactory. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a clean, convenient and practical tool for filling the power module with heat-conducting glue between two PCB boards of the power module quickly. [0004] The furthe...

Claims

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Application Information

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IPC IPC(8): H05K7/20
Inventor 陈绪胜
Owner ASTEC POWER SUPPLY (SHENZHEN) CO LTD
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