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Packaging fixation structure equipment of piezoelectricity fold stack driver

A technology of piezoelectric stacking and packaging structure, which is applied in the direction of piezoelectric devices/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, piezoelectric effect/electrostrictive or magnetostrictive motors, etc. , can solve problems such as difficult pre-tightening force, unbalanced force on the connecting part, inflexible assembly of the driver and driven parts, etc., to achieve a reliable installation method, improve reliability and repeatability

Inactive Publication Date: 2008-07-30
DALIAN UNIV OF TECH
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The common fixing method is pasting. This method is not flexible in the assembly of the driver and the driven part, and it is difficult to apply the pre-tightening force. Moreover, since the piezoelectric stack driver is directly connected to the driven part, there is still a problem that the driving displacement does not pass through. Disadvantages such as enlargement of the elastic body and unbalanced force on the connecting part

Method used

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  • Packaging fixation structure equipment of piezoelectricity fold stack driver
  • Packaging fixation structure equipment of piezoelectricity fold stack driver

Examples

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Embodiment Construction

[0012] In conjunction with accompanying drawing 1, accompanying drawing 2, accompanying drawing 3 and accompanying drawing 4 describe the specific implementation of the present invention in detail, insert the piezoelectric stack driver from the mounting hole of the fixed plate, and the lead wire on the driver enters along the wire groove; After the stack driver fully enters the package fixing structure, fix the fixed plate on the support through the four mounting holes on the fixed plate; then install a pre-tightening nut on the bottom of the piezoelectric stack cavity, and the end face of the nut is tightly against the piezoelectric Stack the drive faces and apply some preload. Four installation holes are processed on the upper end surface of the piezoelectric stack cavity for fixing the driven components.

[0013] After the piezoelectric stack is installed in the package fixing structure, the pre-tightening nut is tightly pressed against the extended end of the piezoelectric...

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Abstract

The invention discloses an encapsulation fixing structure device of a piezoelectric stack actuator, belongs to the technical field of precision machinery and equipment, and relates to nanometer driving and precision positioning. The encapsulation fixing structure device of the piezoelectric stack actuator comprises an encapsulation structure main body, a pre-load nut, and the piezoelectric stack actuator. In the encapsulation structure main body, the shape formed by a fixed plate and two wings is is an inverted U; the two sides of a piezoelectric stack cavity are connected with the two wings through a linear spring beam in a flexible way, thereby being easy for the installation and down-lead of a piezoelectric stack; a piezoelectric stack mounting hole is processed on the fixed plate; the mounting hole is communicated with a hollow cavity of the piezoelectric stack cavity; a wiring trough is processed on the two sides of an inner wall of a connecting cavity; an inner screwed hole is opened on one end of the piezoelectric stack cavity apart from the fixed plate. The invention is applied to high-precision nanometer driving, high-frequency harmonic resonance driving and a high-precision locating system.

Description

technical field [0001] The packaging and fixing structure device of the piezoelectric stack driver of the present invention belongs to the technical field of precision machinery and instruments, and relates to the aspects of nano drive and precise positioning. Background technique [0002] Piezoelectric stack drivers are used in precision instruments or equipment to realize nanoscale displacement driving, force driving, resonance driving, etc. Common piezoelectric stack drivers are unpackaged, that is, bare piezoceramic stacks, and there are also packaged piezoceramic stack drivers, such as PI’s piezoelectric stack drivers with mounting threads at one end. When the piezoelectric ceramic stack is applied, it is generally required to fix one end and connect and fix the other end with the driven part. The common fixing method is pasting. This method is not flexible in the assembly of the driver and the driven part, and it is difficult to apply the pre-tightening force. Moreove...

Claims

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Application Information

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IPC IPC(8): H02N2/00H02N2/04H01L41/09H01L41/053
Inventor 褚金奎张段芹侯志武齐东周王晓东
Owner DALIAN UNIV OF TECH
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