Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Tft substrate inspecting apparatus

A substrate inspection and substrate technology, which is applied in measurement devices, optics, instruments, etc., can solve the problems of electron beam confusion, electron beam influence, and long-term TFT substrate inspection, so as to reduce the impact and avoid long-term retention.

Inactive Publication Date: 2008-05-07
SHIMADZU SEISAKUSHO CO LTD
View PDF1 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the electric field generated by the high current flowing through the heating unit may affect the electron beam
[0008] Therefore, when the TFT substrate is heated to a high temperature and substrate inspection is performed, there are problems in that it takes a long time for the TFT substrate inspection; the yield of the TFT substrate decreases; or the electron beam is disturbed by the electric field

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Tft substrate inspecting apparatus
  • Tft substrate inspecting apparatus
  • Tft substrate inspecting apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

[0039] FIG. 1 is a schematic diagram illustrating a TFT substrate inspection device according to the present invention. The TFT substrate inspection apparatus 1 includes an inspection chamber 4 for inspecting a TFT substrate 9, a load lock chamber (LL chamber) 2 for transferring a TFT substrate 9 between the outside and the TFT substrate inspection apparatus 1, and a load lock chamber in the load lock chamber. 2 and the transfer chamber 3 for transferring the TFT substrate 9 between the inspection chamber 4.

[0040] The load lock chamber 2 includes a heating unit 10 that leads and introduces the TFT substrate 9 between the outside and the transfer chamber 3 , and preliminarily heats the introduced TFT substrate 9 . The heating unit 10 uses a large heat capacity to quickly heat the TFT substrate 9 introduced into the load lock chamber 2 from normal temperatur...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

[PROBLEMS] To inspect a substrate in a short time at a high temperature in a TFT substrate inspecting apparatus. [MEANS FOR SOLVING PROBLEMS] The TFT substrate inspecting apparatus (1) is provided with an inspection chamber (4) for inspecting an introduced TFT substrate (9), and a load lock chamber (2) for introducing the TFT substrate into the inspection chamber. The load lock chamber (2) is provided with a heating means (10) for preheating the introduced TFT substrate, and the inspection chamber (4) is provided with a thermal insulating means (11) for keeping the temperature of the TFT substrate introduced from the load lock chamber. The TFT substrate in a high temperature state is introduced into the inspection chamber by preheating the TFT substrate (9) by the heating means (10), thus, substrate inspection is performed without requiring a mechanism for heating the substrate to a high temperature in the inspection chamber nor requiring a time to increase the temperature in the inspection chamber.

Description

technical field [0001] The present invention relates to a TFT substrate inspection device, in particular to a TFT substrate inspection device for inspecting a TFT substrate introduced into the inspection device at a high temperature. Background technique [0002] It is known that a semiconductor manufacturing apparatus can heat a substrate including a sheath heater in a vacuum state (see Japanese Laid-Open Patent Publication No. 8-20868). [0003] Regarding the TFT substrate inspection device, although TFT substrate inspection is usually performed at room temperature, it is expected that by performing TFT substrate inspection at a high temperature, it is expected that defects in TFT substrates that are difficult to detect at room temperature can be easily detected and the efficiency of defect detection will be improved. efficiency. [0004] When inspecting the TFT substrate in a high temperature state, it may be considered to install a heating unit in the inspection room, a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/00G02F1/13
CPCG01R31/2875G09G3/006G01R31/2862G02F1/1368G02F1/136254
Inventor 小西康雄
Owner SHIMADZU SEISAKUSHO CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products