Cooling structure of electronic device

Abstract

The invention discloses a heat elimination structure of an electronic device, being used for the heat elimination of a heat source of the electronic device, which comprises a casing, in which a holding space is formed and the heat source is positioned; a heat elimination module embedded on the casing and provided with a contact part and a heat elimination part, wherein the contact part is contacted with the heat source in the holding space, absorbs the heat generated by the heat source and conducts to the heat elimination part, the heat elimination part is positioned outside the casing, and is used for dissipating the heat generated by the heat source. The invention can also comprises a casing, in which a holding space is formed, the heat source is positioned, and contacted with the inner side of the holding space; a heat elimination module provided with an embedding part and a heat elimination part, wherein the embedding part is used for embedding the heat elimination module on the casing and corresponding to the heat source, and the heat elimination part is positioned outside the casing.

Description

【Technical field】 [0001] The invention relates to a heat dissipation structure, in particular to a heat dissipation structure of an electronic device. 【Background technique】 [0002] Recently, in order to make electronic devices thinner, lighter, and more powerful, the size of the chip needs to be made smaller and smaller, and the calculation speed needs to be faster and faster, but the result of faster and faster calculation speed, relatively, the chips produced There will be more and more heat in the electronic device, and when the heat inside the electronic device cannot be dissipated due to accumulation, it will affect the reliability and performance stability of the electronic components in it, and even shorten its life. Therefore, the design of the heat dissipation structure in the electronic device has become an important issue that cannot be ignored when designing the electronic device. [0003] For portable electronic devices, such as notebook computers, palmtop co...

AI Technical Summary

Problems solved by technology

[0006] In view of the fact that the speed of the current chip is getting faster and faster, and the heat generated by it is also increasing, the casing 11 of the existing military and industrial notebook computer is not enough to effectively and quickly dissipate heat sources 13 such as the central processing unit or high-speed computing chips. A large amount of heat generated quickly is exported, and when the heat energy generated is greater than the load of natural convection, its high temperature will cause the system to overheat, and even make the system malfunction

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