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Reconfigurable chassis module

A casing and modular unit technology, applied in the field of reconfigurable casing modules, can solve problems such as long time, difficulty in maintenance and service of internal components, and the degree of hindering the modularization of casings, so as to reduce weight and cost and speed up listing Speed, development cost reduction effect

Inactive Publication Date: 2008-02-20
HUANDA COMPUTER (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0003] Furthermore, the traditional case design includes a multi-piece composite structure of metal sheets, which hinders the degree of modularization of the case
And the traditional design also makes repair service of internal components difficult and must take a long time to complete

Method used

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Embodiment Construction

[0018] Please refer to Figure 1, Figure 2, Figure 3 and Figure 4. The computer system of the present invention includes necessary hardware units, such as: a main board 30, an interposer board 40, a power supply module 50, fans 61, 62, 63 and an intermediary board 70, which are respectively arranged on the first module unit 10 of the chassis module and the second modular unit 20 .

[0019] The motherboard 30 is a printed circuit board configured with different circuit components, such as: a central processing unit (CPU), a system memory, a north-south bridge chip, an input / input controller, a network interface controller, and an input / input connector. Components are connected to a specific bus and perform data processing work under the operating system. The interposer 40 provides additional functions and compatibility of the computer system, and has different interfaces under different operation implementations. According to the computer system of the present invention, a dis...

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Abstract

A scalable computer system includes a reconfigurable chassis module, plural hardware units and one or more inter-plane. The chassis module has plural modular units for configuring the hardware units therein respectively. Each of the modular units has dedicated framework to attach the inter-plane or dedicated fans. The inter-plane is to connect with the separated hardware units between the modular units. Each of the modular units is equipped with compatible male and female joints to engage with each other. Certain fastening assemblies may be applied to secure male-male or female-female joints, thereby enabling the modular units to be front-to-back and / or side-by-side connections.

Description

【Technical field】 [0001] The invention relates to a casing design of an electronic device, in particular to a reconfigurable casing module of an upgradeable computer system. 【Background technique】 [0002] The enclosure design of traditional electronic devices requires a fixed and pre-set integral support enclosure to provide mechanical support for the internal electronic components. This limitation prevents some reconfigurable options from being part of the basic design of the overall enclosure and internal structure. In general, any system that does not require total reconfigurability has unnecessary weight, unused spare space, and unnecessary expense. As future technology develops, the mechanism design may not be able to comply with the new form factor, and a new case may need to be redesigned to support the technology features, which will require additional costs. For example: new central processing unit (CPU) and memory upgrades require new power supplies or new inter...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18
Inventor 李宠平井智则钟志明
Owner HUANDA COMPUTER (SHANGHAI) CO LTD
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