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Substrate processing apparatus

A technology for processing equipment and equipment, applied in the direction of gaseous chemical plating, coating, electrical components, etc., capable of solving problems such as insulator 20 material and design limitations

Inactive Publication Date: 2008-01-30
JUSUNG ENG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0014] However, insulator 20 may be affected by thermal expansion of metal components in chamber 11
Therefore, there are many restrictions on the material and design of the insulator 20

Method used

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  • Substrate processing apparatus
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Embodiment Construction

[0030] Reference will now be made in detail to the preferred exemplary embodiments, examples of which are illustrated in the accompanying drawings.

[0031] The purpose of the present invention is to completely insulate the surfaces of different potentials in the substrate processing equipment, and does not limit the structure of the gas distribution plate and the plasma electrode. More precisely, the invention is directed to insulating two components having different potentials or two potential surfaces in a substrate processing apparatus or chamber. The present invention is not limited to the insulating member provided between the gas distribution plate and the electrodes as will be explained below.

[0032] The substrate processing apparatus of the present invention may have a structure similar to that of FIG. 1 . Components that are the same as those in the related art may have the same references, and explanations for the same components may be omitted.

[0033] In orde...

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Abstract

A substrate treatment device, including: a chamber with a first potential; a first electrode, locating in the chamber and having a second potential, the first potential and the chamber are separated by gap wherein; a second electrode, locating in the chamber and separating with the first electrode. A response area is defined between the first electrode and the second electrode, and connects to the gap; a insulator, setting in the gap and including a first component and a second component separated along a first direction; and a buffering insulator, locating between the first component and the second component.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2006-0070373 filed on Jul. 26, 2006, which is incorporated herein by reference. technical field [0002] The present invention relates to an apparatus for manufacturing a semiconductor device or a flat panel display, and more particularly, the present invention relates to a substrate processing apparatus for processing a substrate such as a wafer or glass using plasma. Background technique [0003] In general, a flat panel display such as a liquid crystal display or a plasma display panel or a semiconductor device is manufactured by forming a predetermined circuit pattern through a thin film deposition process, a photolithography process, and an etching process on a substrate. Each process is performed in a substrate processing facility where optimal conditions have been set. [0004] Recently, substrate processing equipment using plasma has been widely used to deposit or etch thin films. [0005...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/50H01L21/205H01L21/365H01L21/67
CPCC23C16/4401C23C16/509
Inventor 河政旼
Owner JUSUNG ENG
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