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Method and apparatus for scribing brittle material board and system for breaking brittle material board

The technology of a brittle material substrate and a scribing device is applied in the fields of scribing and scribing devices for brittle material substrates and cutting systems for brittle material substrates, which can solve the problems of scribing lines that cannot be formed straight, and achieve the effect of expanding the scope.

Inactive Publication Date: 2007-11-07
MITSUBOSHI DIAMOND IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the portion where the scribing line is formed protrudes upward, and the cutter wheel 904 is pressed and rotated along the planned scribing line, on the mother glass substrate 90, the formation of the vertical crack (scribing line SL) Continuously, uncontrollable cracks UC are derived in the direction of the scribing line, so it may not be possible to form a straight scribing line

Method used

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  • Method and apparatus for scribing brittle material board and system for breaking brittle material board
  • Method and apparatus for scribing brittle material board and system for breaking brittle material board
  • Method and apparatus for scribing brittle material board and system for breaking brittle material board

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no. 1 approach

[0082] In the first embodiment, an example of a scribing method is shown in which internal stress in the vicinity of a line to be scribed is made uniform by compressing or stretching a brittle material substrate in the same direction as the scribing direction.

[0083] FIG. 1 is a perspective view showing a schematic configuration of a scribing device according to the present invention. This scribing device 10 is a device for forming scribing lines on a mother glass substrate 90 . As shown in FIG. 1 , the scribing device 10 includes a slide table 12 that reciprocates in the horizontal direction (Y-axis direction in the figure) along a frame 11 .

[0084] The slide table 12 is slidably supported along a pair of horizontal guide rails 14 and 15 which are arranged on the upper surface of the frame 11 in parallel to each other along the Y-axis direction. On the intermediate portion of the two guide rails 14 and 15 , a ball screw 13 parallel to the guide rails 14 and 15 and rotate...

no. 2 approach

[0102] In the second embodiment, an example of a scribing method for uniformizing internal stress near a line to be scribed is shown by compressing or stretching a brittle material substrate in a direction perpendicular to the scribing direction. In addition, in this example, an example of a scribing device including an internal stress detection mechanism is shown.

[0103] Fig. 3 is a schematic configuration perspective view showing another embodiment of the scribing device of the present invention. This scribing device 40 is similar to that shown in FIG. The scribing device of the first embodiment is not different in configuration, so detailed descriptions of the same members are omitted by using the same symbols for them.

[0104] A pair of first holding table 41 and second holding table 42 that reciprocate in the Y-axis direction in a horizontal state are provided on the upper surface of small table 18 . The first holding table 41 and the second holding table 42 are supp...

no. 3 approach

[0124] In the third embodiment, the scribing line is shown in which the internal stress in the vicinity of the planned scribing line is made uniform by compressing or stretching the brittle material substrate in a direction inclined 45 degrees to the horizontal direction with respect to the scribing line direction. An example of a device.

[0125] Fig. 6 is a schematic configuration perspective view showing another embodiment of the scribing device of the present invention. In addition to the configuration of the first holding table and the second holding table, and the moving directions of the first holding table and the second holding table, the scribing device 60 is relative to the X axis perpendicular to the sliding direction of the sliding table 12. Except for the state where the direction is set at an inclination angle of 45 degrees, there is no structural difference from the scribing device of the second embodiment shown in FIG. 1 , so detailed descriptions of the same ...

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Abstract

According to the inventive method and apparatus for scribing brittle material board and system for breaking brittle material board, generation of uncontrollable unnecessary cracks in unspecified directions is prevented during scribing process of a brittle material board. A mother glass board (90) is provided on the surface of a first holding table (21) and a second holding table (22). When the mother glass board is fixed on the first holding table (21) and the second holding table (22) by being sucked from a suction hole by a vacuum pump and the like, nonuniform internal stress existing in the mother glass board (90) is adjusted in a specific direction for scribing, by moving the first holding table (21) and / or the second holding table (22) a minute distance along a prescribed direction.

Description

technical field [0001] The present invention relates to a scribing method for scribing brittle material substrates such as semiconductor wafers, glass substrates, and ceramic substrates along predetermined scribing lines of the brittle material substrates, a scribing device using the method, and cutting of brittle material substrates system. Background technique [0002] In a display device of a flat display panel such as a liquid crystal display panel, a plasma display panel, or an organic EL display panel, two glass substrates, which are brittle material substrates, are usually bonded to form a panel substrate. When manufacturing such a panel substrate, the mother glass substrate is cut into glass substrates of a predetermined size. In the cutting process of the glass substrate, a scribe line is formed along the planned scribing line of the mother glass substrate, and then a predetermined bending stress is applied with the formed scribe line as a central axis, whereby the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00B28D7/04C03B33/033
CPCC03B33/107B28D5/0011B65G2249/04C03B33/03C03B33/033C03B33/10Y02P40/57C03B33/02
Inventor 高松生芳音田健司
Owner MITSUBOSHI DIAMOND IND CO LTD
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