Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Printed circuit board processing device and drilling processing method therefor

A technology of printed circuit boards and processing equipment, applied in the direction of printed circuit, printed circuit manufacturing, metal processing equipment, etc.

Inactive Publication Date: 2010-07-28
HITACHI SEIKO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In Patent Document 1, there is no disclosure about, for example, how to improve the processing accuracy when processing printed circuit boards with the same processing content
[0008] In addition, in the case of moving the horizontal slide plate, similar to when moving the X table, vibrations in the vertical direction are generated on the bed, so if the patent document 2 The technology corresponds to the movement of the X table and the horizontal slide plate, and the overall size of the drill bit drilling processing equipment becomes larger
[0009] In addition, in the case of Patent Document 3, the moving directions of the pair of sliders are opposite to each other, and nothing is disclosed about the X-direction movement control of the headstock supporting the workpiece. content

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board processing device and drilling processing method therefor
  • Printed circuit board processing device and drilling processing method therefor
  • Printed circuit board processing device and drilling processing method therefor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0048] In the above-mentioned first embodiment, one of the two printed circuit boards is rotated 180° relative to the other and arranged on the table, and when the processing position is, for example, point-symmetrical or nearly point-symmetrical with respect to the center of the printed circuit board in the XY direction ,Such as Figure 7 As shown, the directions of the printed circuit boards 1a and 1b loaded on the workbenches 2a and 2b can also be set to be the same, as indicated by the arrows in the same drawing, and the processing order of the adjacent printed circuit boards can be set to be opposite to each other and processed. .

[0049] In addition, in the above-mentioned Embodiments 1 and 2, it has been described that a plurality of lateral slide plates 8a, 8b are arranged on one side of the column body 9 ( figure 1 In the case of the front side), but can also be set as follows.

Embodiment 3

[0051] Figure 8 is a plan view showing the structure of other printed circuit board processing equipment to which the present invention is applied, and figure 1 Components that are the same or have the same function are given the same reference numerals and descriptions thereof are omitted.

[0052] As shown in the same figure, the printed circuit board processing equipment not only has figure 1 The shown workbenches 2a, 2b and lateral slide plates 8a, 8b also include workbenches 2c, 2d and lateral slide plates 8c, 8d.

[0053] The table 2c and the table 2a, and the table 2d and the table 2b are arranged on the bed 10 so that the moving direction of the center of gravity is coaxial. Tables 2c and 2d are freely movable in the front-back (X) direction by linear guides (not shown) and X-axis drive devices 3c and 3d. Printed circuit boards 1c, 1d are respectively arranged on workbenches 2c, 2d. In addition, the printed circuit board 1c is rotated by 180° relative to the pri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The device has printed circuit boards mounted on respective tables, and a control unit controlling an X-axis drive section and a Y-axis drive section to move an X-direction axle and Y-direction axle in a direction. The axles are positioned in processing positions by the X-axis drive section and a Y-axis drive section. The axes are determined such that drills are put into a printed circuit board by a Z-axis drive section to drill holes. The z-axis drive section moves a spindle into corresponding z-direction. An independent claim is also included for a method for drilling a printed circuit board processing device.

Description

technical field [0001] The invention relates to printed circuit board processing equipment and a drilling method thereof. Background technique [0002] As printed circuit board processing equipment, there is, for example, a printed circuit board processing equipment provided with: a single bed forming a plurality of table loading areas; being integrally fixed to the above bed across the table loading areas, and A column forming a support area for a plurality of transverse slides corresponding to the loading area of ​​the workbench; at least one workbench individually movably supported on the above bed in the X direction; individually movably supported in the Y direction on the above-mentioned column at least one transverse sliding plate on the top; and individual spindle units movably supported on the transverse sliding plate along the Z direction. Since this type of printed circuit board processing equipment has a structure in which a plurality of printed circuit board pro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
CPCB23B39/18H05K3/0097H05K3/0047B23B39/161H05K3/0008B23Q5/22H05K13/00
Inventor 渡边一雄熊谷德成长泽胜浩山下孝彦镰田弘幸腰塚久洋菅原弘之宫坂彻
Owner HITACHI SEIKO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products