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Coating device and coating method

A coating device and coating technology, which is applied in the direction of surface coating liquid devices, coatings, electrical components, etc., can solve problems such as difficult coating, damage or deformation

Active Publication Date: 2009-12-16
艾美柯技术株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] In addition, in Patent Document 2, when the tip of the slit nozzle comes into contact with the convex portion, it may be damaged or deformed.
In this case, it is difficult to apply uniformly in the length direction of the slit

Method used

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Examples

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Embodiment Construction

[0036] Embodiments of the present invention will be described below with reference to the drawings.

[0037] figure 1 It is a plan view showing one embodiment of the coating device according to the present invention, figure 2 yes figure 1 side view of the main part, image 3 yes figure 2 A-direction view.

[0038] In the substrate coating apparatus of this embodiment, if figure 1 As shown, a pair of parallel guide rails 2 and 2 are provided on the base 1 , and a substrate placing part 3 for placing a substrate W is fixed at the middle position of the guide rails 2 and 2 , that is, the center of the surface of the base 1 . In addition, the gate-shaped moving mechanism 4 straddles the substrate placement portion 3 and is movably installed between the guide rails 2, 2, and the slit nozzle 5 is attached to the gate-shaped moving mechanism 4 via a lifting device.

[0039] In addition, in the present embodiment, in particular, in the substrate placement unit 3, reference jig...

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Abstract

The present invention provides a coating device for easily determining the parallel reference and height reference of a slit nozzle, and for precisely fine-tuning the distance between the substrate surface and the lower end of a slit nozzle. In the coating device, two reference clamping tools (6, 6) for determining parallel reference and height reference of a slit nozzle (5) are fixed on both ends of the side of coating starting position on the substrate position part (3) in the extent direction of said side. The reference clamping tool (6) has a lifting contactor for length measurement (8) which sets a bottom dead center to a position equal to upper surface of the contactor for length measurement height (8) and upper surface of the substrate position part (3) in height by applying forces upwards using a spring and the like, wherein the position is regarded as a datum point in height direction.

Description

technical field [0001] The invention relates to a coating device and a coating method for coating a developing solution, a cleaning solution, an SOG solution, a resist, and the like on substrates such as glass substrates and semiconductor wafers. Background technique [0002] In the manufacturing process of liquid crystal (LCD), PDP (plasma display), semiconductor elements, etc., in order to form various coatings on the substrate, or to apply cleaning solution or developer solution, coating with a slit nozzle is used device. [0003] Recently, with the trend of increasing the size of the substrate, a coating device that performs coating while moving a wide slit nozzle relative to the substrate in one direction has been added instead of coating while rotating the substrate. Conventional spin coating. A coating device having such a slit nozzle is advantageous in that a uniform thick film can be formed on the surface of even a large substrate. However, there are some other p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C17/00
CPCB05C5/0225B05C11/1018B05D1/26H01L21/027
Inventor 高濑真治楫间淳生
Owner 艾美柯技术株式会社
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