Heat release structure of direct cooling refrigerator

A refrigerator and cold-type technology, which is applied in the field of heat release structure of direct cooling refrigerators, can solve the problems that the heat release area of ​​the condenser 400 cannot be fully ensured, and the heat release efficiency of the condenser 400 is low, so as to improve the heat release efficiency and discharge The effect of increased thermal area

Inactive Publication Date: 2008-11-12
LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] But, the heat release structure of the conventional direct-cooling refrigerator as mentioned above has the following disadvantages: since the condenser 400 is buried between the inner wall surface of the rear side of the casing 100 and the heat insulating material 210, as figure 2 As shown, the condenser 400 is in line contact with the shell 100
Therefore, the heat radiation area of ​​the condenser 400 cannot be sufficiently ensured, and the heat radiation efficiency of the condenser 400 is low.

Method used

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  • Heat release structure of direct cooling refrigerator
  • Heat release structure of direct cooling refrigerator
  • Heat release structure of direct cooling refrigerator

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing and specific embodiment the present invention is described in further detail:

[0025] Such as image 3 As shown, the main components of the direct cooling refrigerator according to the embodiment of the present invention include an outer shell 100 , an inner shell 200 , a freezer room R and a refrigerator room F, a mechanical room 300 , a heat insulating material 210 , and a condenser 400 . Wherein, the outer shell 100 forms the appearance of the refrigerator; the inner shell 200 is located inside the outer shell 100, and the rear side is separated from the rear side of the outer shell 100 to form an air flow channel 500; the freezing room R and the refrigerating room F are respectively located inside the inner shell 200 The upper and lower sides of the upper and lower sides of the casing; the mechanical room 300 is located in a certain space at the bottom of the rear wall inside the casing 100, and can be equipped with ac...

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Abstract

This invention discloses a heat releasing structure of direct freezing refrigerator, which comprises casing, inner casing, chilling chamber, refrigerating chamber, mechanism chamber, heat insulating material and chiller, wherein the inner casing is inside the casing, and the back sides of the casing and inner casing are separated to form air flow path; the chilling chamber and refrigerator chamber are on the upper and lower of the inner casing, and the mechanism chamber is in the back side bottom of the casing, having contractor accessory; the heat insulating material is in the back side of the casing, and the chiller is in the inner side of the casing rear side. Said structure increases the heat releasing area, by which it can enhance the releasing efficiency of the chiller.

Description

technical field [0001] The invention relates to a direct-cooling refrigerator, in particular to a heat-radiating structure of the direct-cooling refrigerator which improves the heat-radiating efficiency of the condenser by increasing the heat-radiating area of ​​the condenser. Background technique [0002] In general, a refrigerator is a series of refrigeration cycles that repeatedly undergo compression-condensation-expansion-evaporation through a refrigerant to maintain a low temperature inside the cabinet and keep food fresh for a long time. It is a daily necessity. [0003] The refrigeration cycle system of a refrigerator mainly includes a compressor, a condenser, an expansion valve, and an evaporator. Among them, the compressor raises the temperature and pressure of the gas refrigerant in the low-temperature and low-pressure state, and converts it into a gas refrigerant in a high-temperature and high-pressure state; A liquid refrigerant with a temperature of 40°C and a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F25D19/00F25D23/00F25D17/04F25D11/00
Inventor 金贤申宗民江成希黄俊贤金宗权河三哲
Owner LG ELECTRONICS (TIANJIN) APPLIANCES CO LTD
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