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Substrate processing apparatus, substrate transfer method and substrate transfer device

a technology of substrate and processing apparatus, applied in the direction of storage devices, manipulators, electrical apparatus, etc., can solve the problems of substrate damage, particle generation, and the inability to transfer substrate from a certain place to a certain other place, so as to prevent photo-corrosion and prevent photo-corrosion

Inactive Publication Date: 2015-08-06
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention relates to a substrate processing apparatus with the technical effects of preventing photo-corrosion of copper interconnects due to exposure to light and during maintenance work on a processing unit. The substrate processing apparatus can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion, even if the number of processable substrates temporarily decreases during maintenance work. Additionally, the substrate transfer method and substrate transfer device of the invention can prevent damage to the substrate, generation of particles, and failure in transfer of the substrate by providing a light shielding processing, a light shielding wall, and a light-shielding maintenance door.

Problems solved by technology

When the maintenance door is opened, light will enter the apparatus and may cause photo-corrosion of, e.g., copper interconnects exposed on a surface (surface to be processed) of a substrate.
If the positioning adjustment is insufficient, it is possible that friction may occur between a substrate and the substrate support, causing damage to the substrate and generating particles.
Further, in some cases, a substrate cannot be transferred from a certain place to a certain other place.

Method used

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  • Substrate processing apparatus, substrate transfer method and substrate transfer device
  • Substrate processing apparatus, substrate transfer method and substrate transfer device
  • Substrate processing apparatus, substrate transfer method and substrate transfer device

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Embodiment Construction

[0046]Preferred embodiments of the present invention will now be described in detail with reference to the drawings. The following description illustrates an exemplary case in which a substrate processing apparatus according to the present invention is applied to a cleaning section provided in a CMP (chemical mechanical polishing) apparatus which removes an unnecessary portion of a copper plated film formed on a surface of a substrate, such as a semiconductor wafer, i.e. a portion other than a copper plated film embedded in interconnect trenches and vias, thereby forming copper interconnects.

[0047]A substrate processing apparatus according to the present invention can, of course, be applied to a cleaning section of an apparatus different from a CMP apparatus or to a processing section different from a cleaning section if such a cleaning section or processing section is required to prevent photo-corrosion due to exposure to light.

[0048]FIG. 1 shows an overall external view of a CMP a...

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Abstract

A substrate processing apparatus can prevent photo-corrosion of, e.g., copper interconnects due to exposure of a surface to be processed of a substrate to light, and can perform processing, such as cleaning, of a substrate surface while preventing photo-corrosion of, e.g., copper interconnects due to exposure to light. The substrate processing apparatus includes a plurality of processing areas housing therein processing units which have been subjected to light shielding processing; and at least one transfer area housing therein a transfer robot and disposed between two adjacent ones of the plurality of processing areas. A light shielding wall is provided between the transfer area and each of the two adjacent processing areas, and a light-shielding maintenance door is provided for the front opening of the transfer area. The processing units are coupled to the light shielding walls in a light-shielding manner.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]This document claims priorities to Japanese Application Number 2011-123369, filed Jun. 1, 2011 and Japanese Application Number 2011-173704, filed Aug. 9, 2011, the entire contents of which are hereby incorporated by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The present invention relates to a substrate processing apparatus, and more particularly to a substrate processing apparatus which can perform processing, such as cleaning, of a surface (surface to be processed) of a substrate, such as a semiconductor wafer, while preventing photo-corrosion of, e.g., copper interconnects, formed in the surface of the substrate, due to exposure of the interconnects to light.[0004]The present invention also relates to a substrate transfer method for transferring a substrate and a substrate transfer device, and more particularly to a substrate transfer method for transferring a substrate in a substrate processing apparatus ...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): H01L21/677B25J11/00
CPCH01L21/6704H01L21/67173H01L21/67196H01L21/67219H01L21/67718H01L21/68707B25J11/0095H01L21/67706H01L21/67742
Inventor YOKOYAMA, TOSHIOKUNISAWA, JUNJIMIYAZAKI, MITSURUSUZUKI, KENICHISOTOZAKI, HIROSHI
Owner EBARA CORP
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