Three-dimensional integrated circuit structure and method of making same
a technology of integrated circuits and manufacturing methods, applied in the direction of transistors, solid-state devices, nanoinformatics, etc., can solve problems such as wide us
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[0065] A 3-D IC in accordance with the present invention is shown in FIG. 2. Embodiments of the present invention provide a device integration technology.
[0066] Reference herein to “one embodiment”, “an embodiment”, or similar formulations, means that a particular feature, structure, operation, or characteristic described in connection with the embodiment, is included in at least one embodiment of the present invention. Thus, the appearances of such phrases or formulations herein are not necessarily all referring to the same embodiment. Furthermore, various particular features, structures, operations, or characteristics may be combined in any suitable manner in one or more embodiments.
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[0067]“ASIC” refers to Application Specific Integrated Circuit. “SoC” refers to a System on a Chip, with “SoCs” being the plural of SoC. A SoC may be an ASIC but is not required to be. An ASIC may be a SoC but is not required to be.
[0068] The expression “back bias”, as used herein, refe...
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