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Composition for release layer of in-mold decoration

a technology of in-mold decoration and release layer, which is applied in the direction of transportation and packaging, synthetic resin layered products, coatings, etc., can solve the problems of reducing the efficiency of the photoinitator in the composition, bringing many tradeoffs, etc., and achieves room-light handling, improved release characteristics, and improved shelf life stability.

Inactive Publication Date: 2005-11-17
WANG FEI +6
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011] The release layer of the present invention has improved release characteristics, adhesion properties, room-light handleability and shelf-life stability, without the tradeoff in photosensitivity in the post-molding UV curing step.

Problems solved by technology

However, incorporating a UV absorber into a durable layer (i.e., protecting layer) formulation brings many tradeoffs.
For example, it decreases the efficiency of the photoinitiator in the composition due to competitive light absorption of the UV absorber.

Method used

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  • Composition for release layer of in-mold decoration
  • Composition for release layer of in-mold decoration

Examples

Experimental program
Comparison scheme
Effect test

example 1

UV Screening Efficiency

A. Formation of Film Comprising a Release Layer of the Present Invention

[0059] 1.53 Grams of Durite SD-1708 (phenolic resin, Bordon Chemical, Inc.) was dissolved in 7.2 gm of MEK. 1.3 Grams of CYMEL 303ULF (methylated melamine resin, Cytec Industries Inc), 0.03 gm of CYCAT 600 (DDBSA, dodecylbenzene sulfonic acid, a crosslinking catalyst, Cytec Industries Inc.), 0.07 gm of DMS S12 (silanol terminated polydimethylsiloxane, Gelest Inc.) and 1.4 gm of CAB 553-04 (10% in MEK) (cellulose acetate butyrate, Eastman Chemical Co.) were then added and mixed with a Vortexer. The release layer composition formed was coated on a PET film (1.42 mil, PT1 from Mitsubishi, Interfilm Holding, Inc., Easley S.C.) with a #6.5 Meyer bar with a target thickness of about 2 um. The coated film was dried at 70° C. for 5 minutes and cured at 120° C. for 10 minutes.

[0060] The resultant film was then exposed to UV (Fusion V, H lamp at dosage of 4.2 J / cm2) using a conveyor curing syste...

example 2

Thermal Sensitive Release & Edge Sharpness Improvement

[0065] The composition of the release layer of Example 1A was used in this example. A durable layer was prepared by pre-reaction of 6.84 gm (15% in MEK) of CAP-504-0.2 (cellulose acetate propionate, from Eastman Chemical Co.) and 1.89 gm CaCO3 (27.5% in MEK, containing 6.27% CAP-504-0.2) with 2.53 gm (15% in MEK) of Desmodur N3300A (polyisocyanate, Bayer Polymers) and 0.1% DBTDL at 50° C. for 18 minutes. After pre-reaction, the following ingredients were then added into the pre-reacted CAP solution: 2.94 gm (50% in MEK) of Ebecryl 1290 (aliphatic polyurethane acrylate, UCB Chemicals), 0.1 gm of MEK-ST (30% in MEK, a silica dispersion from Nissan Chemicals), 0.40 gm of (25% in MEK) 1:1 w % ratio of triethanolamine and poly-Q (aminated tetrol from Arch Chemicals, Norwalk, Conn.) and 0.43 gm of a photoinitiator (PI) solution containing 1.5% of BMS (4-(p-tolylthio)benzophenone, Aldrich, Milwaukee, Wis.), 0.8% of Irgacure 651 (2,2-di...

example 3

Less Yellowness

[0067] The same compositions of Example 1A were used except that, in the release layer, 1.53 gm of Resicure 5200 (meta-Novolac resin, Shenectady International Inc.) was used to replace Durite SD-1708, 0.12 gm of CYCAT600 was used to replace 0.03 gm of CYCAT and 3.06 gm of CAB 553-04 (10% in MEK) was used to replace 1.4 gm of CAB 553-04. The same degree of UV screening was observed with little yellowing in the visible region.

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Abstract

This invention relates to a composition suitable for the formation of a release layer in an in-mold decoration or thermal transfer printing process.

Description

RELATED APPLICATION [0001] This application claims the priority under 35 USC 119(e) of U.S. Provisional Application No. 60 / 564,018 filed on Apr. 20, 2004, the content of which is incorporated herein by reference in its entirety.FIELD OF THE INVENTON [0002] This invention relates to a composition suitable for the formation of a release layer in an in-mold decoration or thermal transfer printing process. BACKGROUND OF THE INVENTION [0003] In-mold decoration processes involve decorating articles as they are formed, in mold, of a heated plastic material being injected into a mold cavity. Usually a tape or strip of a decorating or protective material is automatically or manually advanced, pre-fed and positioned in the mold cavity at each molding cycle, interfacing therein with the plastic material as it is filled into the mold cavity, under heat and pressure. As the article is formed, the decorating material forms on the surface of the article and becomes an integral and permanent part o...

Claims

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Application Information

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IPC IPC(8): B29C45/14B32B7/12B32B9/00C08L61/06C08L61/24C08L61/28C09D175/14
CPCB29C45/14811Y10T428/2839B29K2715/006B29K2995/002B29K2995/0087B32B7/12C08L61/06C08L61/24C08L61/28C08L2205/02C09D175/14B29C45/14827Y10T428/28Y10T428/2809Y10T428/1476Y10T428/2813Y10T428/14Y10T428/2848C08L2666/16B32B7/06B32B2305/72B32B27/42B32B2038/0076B32B27/36B32B27/08
Inventor WANG, FEITSENG, SCOTT C.J.WANG, XIAOJIAFENG, KAI-CHIAGU, HAIYANZANG, HONGMEILIANG, RONG-CHANG
Owner WANG FEI
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