Electronic component moving device, surface mounting machine and ic automatically conveying device

A technology for electronic components and transfer devices, which is applied to electrical components, electrical components, printed circuits, etc., can solve the problem of not being able to load multiple inspection sockets at the same time for component inspection, and achieve the effect of correcting adsorption deviation and correcting deviation.

Inactive Publication Date: 2007-04-04
I-PULSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, when the position of multiple inspection sockets deviates in a direction different from the direction in which the suction heads are arranged, there is a problem that multiple inspection sockets cannot be loaded at the same time for component inspection.

Method used

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  • Electronic component moving device, surface mounting machine and ic automatically conveying device
  • Electronic component moving device, surface mounting machine and ic automatically conveying device
  • Electronic component moving device, surface mounting machine and ic automatically conveying device

Examples

Experimental program
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Effect test

no. 1 Embodiment

[0087] Hereinafter, an embodiment of an electronic component transfer device according to the present invention will be described in detail with reference to FIGS. 1 to 16 . Here, an example in which the electronic component transfer device according to the present invention is applied to a surface mounter will be described.

[0088] Fig. 1 is a top view showing the structure of the surface mounter of this embodiment, Fig. 2 is the same side view, Fig. 3 is a top view showing the structure of the conveyor belt, Fig. 4 is a top view showing the structure of the suction head unit, Fig. 5 is a top view of the suction head unit side view. 6 to 8 are sectional views showing the structure of the third driving device. FIG. 6 is a sectional view taken along line VI-VI in FIG. 5 , and FIG. 7 is a sectional view taken along line VII-VII in FIG. 5 . Cutaway view along line VIII.

[0089] Fig. 9 is a longitudinal sectional view of the suction head, which is a sectional view taken along ...

no. 2 Embodiment

[0193] The electronic component transfer device according to the present invention can be applied to an automatic IC transfer device as shown in FIG. 21 .

[0194]21 is a plan view showing the configuration of an automatic IC transfer device using the electronic component transfer device according to the present invention. In this figure, components that are the same as or correspond to the structures described above with respect to FIGS. 1 to 12 are denoted by the same reference numerals, and detailed description thereof will be appropriately omitted.

[0195] The IC automatic transfer device 210 shown in FIG. 21 includes: a plurality of inspection sockets 212 arranged on one end of the base 211 (the end in the Y direction in FIG. 21 ), and four tray lifters arranged on the base 211. Table 213 , component recognition camera 214 installed between lift table 213 and inspection socket 212 , moving device 215 for moving suction head unit 4 horizontally above base 211 , and the li...

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PUM

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Abstract

The present invention provides an electronic component moving device, surface mounting machine and IC automatically conveying device, wherein, the electronic component moving device comprises suction head unit (4, 5) moving along the horizontal direction on the substrate (2) and arranged in specified direction in order to support plurality of suction heads (43-45), and it is equipped with a first driving device (61) for making the first suction head (43) move in Y-direction and a second driving device (71) for making the second and third suction heads (44, 45) in X-direction. At least the synchronous suction or synchronous placing for the electronic component can be actualized more reliably by adopting the present invention, thereby efficiency can be improved.

Description

technical field [0001] The present invention relates to an electronic component transfer device, a surface mounter, and an IC automatic transfer device (IC handler) equipped with a drive device for changing the mutual distance of a plurality of suction nozzles provided on a suction head unit. Background technique [0002] Conventionally, as one of electronic component transfer devices for transferring electronic components, there has been a surface mounter that places and mounts electronic components on predetermined positions on a printed circuit board. As a conventional surface mounter, for example, there is a structure disclosed in Japanese Patent Laid-Open Publication No. 2000-114787 (Patent Document 1). The surface mounting machine disclosed in this patent document 1 includes: a base equipped with a conveyor belt for conveying the above-mentioned printed circuit board, a plurality of tape feeders equipped at the front of the base, and a moving device on the base. A suc...

Claims

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Application Information

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IPC IPC(8): H05K13/04H05K13/00H05K3/00
Inventor 小泽一成
Owner I-PULSE CO LTD
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