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Capacitance type sound sensor in micro mechanical and electrical structure

A micro-electromechanical structure, sound sensor technology, applied in the direction of electrostatic sensors, sensors, sensor types, etc., can solve the problems of stray signal reliability, unstable diaphragm sensitivity, etc., achieve stable and reliable performance, and suppress fluctuation noise.

Inactive Publication Date: 2006-12-06
AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this case, the free-floating diaphragm is unstable in sensitivity and can produce unwanted sideways movement, leading to problems such as spurious signals and poor reliability

Method used

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  • Capacitance type sound sensor in micro mechanical and electrical structure
  • Capacitance type sound sensor in micro mechanical and electrical structure
  • Capacitance type sound sensor in micro mechanical and electrical structure

Examples

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Embodiment Construction

[0019] We can obtain capacitive micro-electromechanical structure sound sensors with good sound performance and good practicability from different ways. First, we release the stress in the diaphragm by forming corrugations on it, because the silicon-based diaphragm with a shallow corrugated structure can release its internal stress during the manufacturing process, thereby improving the mechanical sensitivity of the diaphragm and reducing its instability. Compared with the traditional flat diaphragm, the shallow corrugated diaphragm has higher sensitivity, especially for the silicon-based diaphragm which is prone to high residual stress.

[0020] Please refer to Figure 2 to Figure 4 The edge of the suspended shallow corrugated diaphragm 11 of the capacitive MEMS sound sensor according to the first embodiment of the present invention is fixed at a position on the substrate 12, which is essentially formed as a tuning fork structure. The connection terminal 24 is used to connec...

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Abstract

The invention comprises: a base board; a back plane having multi acoustic holes and secured on said baseboard through its support end; and a vibrating membrane hanging on said baseboard. The edge of the vibrating membrane is fixed on one or more places on said baseboard in order to form an air gap between the back plane and the vibrating membrane; on the vibrating membrane there are electrodes; between the vibrating membrane and back plane the capacitor is formed; said vibrating membrane is a shallow ripple vibrating membrane; the back plane electrodes are set on both front side and reverse side of said back plane.

Description

technical field [0001] The invention relates to a sound sensor (commonly known as a microphone), in particular to a capacitive micro-electromechanical structure sound sensor. Background technique [0002] The emergence of micro-electro-mechanical structure (MEMS, Micro-electro-mechanical Systems) processing technology has made it possible to mass-produce capacitive MEMS acoustic sensors. By adopting MEMS processing technology, the performance parameters of the acoustic sensor can be optimized, and it also facilitates the simplification of the manufacturing process and the design of integrated products. The design and fabrication of acoustic sensors using MEMS technology has been described in numerous publications and patents. For example, US Patent Nos. 5,619,476, 5,870,351, 5,894,452, and 6,493,288 describe the fabrication of capacitive ultrasonic sensors. And US Patent Nos. 5,146,435, 5,452,268 and 6,870,937 also describe several types of capacitive sound sensors mainly ...

Claims

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Application Information

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IPC IPC(8): H04R19/00H04R7/14
Inventor 潘政民王云龙孟珍奎
Owner AAC ACOUSTIC TECH (SHENZHEN) CO LTD
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