Ultrasonic connection head and device employing same
A bonding device and ultrasonic technology, applied in the direction of vibrating fluid, non-electric welding equipment, electrical components, etc., can solve the problems of screw looseness and damage, and achieve the effect of easy maintenance and low-cost structure
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[0043] Hereinafter, an embodiment of an ultrasonic bonding apparatus having an ultrasonic bonding head according to the present invention will be described with reference to the drawings.
[0044] In addition, in this embodiment, the case where the electronic component with a bump which is a chip component is mounted on a board|substrate is demonstrated as an example. In addition, other chip components include IC chips, semiconductor chips, optical elements, surface mount components, etc., and represent all forms on the side bonded to the substrate regardless of the type and size of the wafer or the like.
[0045] In addition, as a board|substrate, a resin board|substrate, a glass board|substrate, a film board|substrate etc. are mentioned, for example, and it shows all forms of the side bonded to a chip component.
[0046] figure 1 It is a front view of the key acoustic wave bonding apparatus related to this embodiment.
[0047] The ultrasonic bonding device of this embodime...
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