Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for early stage mobile management of semiconductor equipment and related system

A semiconductor and machine technology, applied in the field of semiconductor machine management, can solve problems such as inability to adjust in real time, loss of semiconductor manufacturers, failure to save, etc.

Inactive Publication Date: 2005-09-21
POWERCHIP SEMICON CORP
View PDF0 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the analysis results must be judged and evaluated by the processing engineer before the initial flow management, and it is impossible to make real-time adjustments based on the analysis results
In addition, the analysis knowledge of semiconductor processing is limited to the analysis results of some test items, such as the performance of semiconductor equipment, data measurement of semiconductor processing, etc. These analysis results are not integrated to provide the initial flow of semiconductor equipment Manage relatively complete reference data, and the knowledge of the initial flow management of semiconductor machines is often lost with the loss of processing engineers, resulting in incalculable losses for semiconductor manufacturers

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for early stage mobile management of semiconductor equipment and related system
  • Method for early stage mobile management of semiconductor equipment and related system
  • Method for early stage mobile management of semiconductor equipment and related system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Please refer to figure 1 , figure 1 It is a schematic diagram of the framework 10 of the initial stage flow management system of the semiconductor equipment of the present invention. The framework 10 of the initial flow management system for semiconductor machines includes a user computer 12 (such as a network server host), multiple semiconductor machines 18, and an initial flow management module 20, wherein the user computer 12 includes a user interface 14 as man-machine interface. The user computer 12 is connected to the semiconductor machine 18 , and the user performs initial flow management of the semiconductor machine 18 through the user interface 14 . Each semiconductor machine 18 is connected to the initial flow management module 20 , and the initial flow management module 20 is connected to the user computer 12 . When each semiconductor machine 18 performs semiconductor processing, the initial flow management module 20 can receive and record some semiconducto...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention provides a method and relative system of early stage drifting management for semiconductor productive platform, which contains recording every treatment parameter of every platform, recording relative equipment parameter, evaluating and recording the quality and relative measured parameter of treatment completed semiconductor products, and analyzing the relationship between every treatment parameter and equipment parameter and relative semiconductor products quality.

Description

technical field [0001] The present invention relates to a method and a related system for managing a semiconductor machine, in particular to a method for managing the initial flow of a semiconductor machine and a related system. Background technique [0002] In semiconductor processing, each semiconductor machine must carry out initial flow management at the beginning of operation in the semiconductor factory to properly adjust the performance and operating parameters of each semiconductor machine to meet the requirements of different semiconductor processing. In the known technology, the initial flow management of semiconductor machines is carried out by more experienced processing engineers in the semiconductor factory. Some data is measured and analyzed during semiconductor processing, and then the initial flow management of semiconductor machines is carried out according to the analysis results. . However, the analysis results must be judged and evaluated by processing ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00
Inventor 戴鸿恩陈建中罗皓觉王胜仁
Owner POWERCHIP SEMICON CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com