Electromagnetic relay

A technology of electromagnetic relays and electromagnets, applied in the direction of electromagnetic relays, electromagnetic relay details, relays, etc., can solve the problems of poor thermal conductivity, low tightness, and limited heat dissipation of electromagnetic relays, and achieve high thermal conductivity and productivity High and maintain productivity effect

Inactive Publication Date: 2004-06-09
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] In addition, in the conventional riveting structure shown in FIG. 5 , only the outer circumference of the protrusion 2 is tightly bonded to the inner circumference of the through hole 4 , and the overall tightness of the components mounted by riveting is low.
Therefore, the thermal conductivity between the parts installed by riveting is also poor, which also limits the heat dissipation of the existing electromagnetic relay

Method used

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Examples

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Embodiment Construction

[0031] Hereinafter, an example of embodiment of the present invention will be described based on the drawings.

[0032] figure 1 It is a perspective view of the electromagnetic relay 10 of this example (the state before the movable contact terminal 18 etc. which will be described later is mounted), figure 2 is an exploded perspective view of the electromagnetic relay 10 . also, image 3 4 is a perspective view of electromagnetic relay 10 (a state before attachment of case 25 , which will be described later), and FIG. 4 is a view showing a caulking structure for attaching movable contact terminal 18 to case 14 , which will be described later.

[0033] Have again, the shell 25 opening side ( image 3 etc.) is referred to as the housing opening side, the lower end side or the lower side, and the opposite side is referred to as the housing inner side, the upper end side or the upper side.

[0034] Electromagnetic relay 10 such as figure 2As shown, it includes: a bobbin 12 f...

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PUM

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Abstract

A small-sized electromagnetic relay which can afford high current and dissipate generated heat efficiently is disclosed. A plate section 18c for coupling to one side of a yoke 14 is formed on a movable contact terminal 18. Countersunk rivet features at three or more positions which are not aligned on a line on the plate section 18c couple the movable contact terminal 18 to the yoke 14. A base end 16b of a movable contact spring 16 is coupled to the surface of the plate section 18c opposite to the yoke 14 to support the movable contact spring 16. In the countersunk rivet feature, each protrusion 14a formed on the yoke 14 is inserted into the corresponding countersunk hole 18d formed on the plate section 18c, respectively, and the tops of the protrusions 14a are crushed to expand its diameter so as to sandwich the plate section 18c against the yoke 14.

Description

technical field [0001] The present invention relates to a small electromagnetic relay mounted on a substrate or the like. Background technique [0002] As an electromagnetic relay mounted on a substrate or the like, for example, an electromagnetic relay disclosed in Patent Document 1 is known, which has: a coil, an iron core, and a yoke (armature) constituting an electromagnet; the movable iron piece (armature); the movable contact spring that makes the restoring force act on the movable iron piece; the movable contact connected with the above-mentioned movable iron piece; the fixed contact arranged opposite to the movable contact; and The fixed contact conducts and leads to the fixed contact terminal outside; the movable contact terminal conducts with the above-mentioned movable contact and leads to the outside. The electromagnetic relay utilizes the attractive force of the electromagnet and the movable contact spring. The restoring force of the above-mentioned movable con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H50/24H01H50/12H01H50/14H01H50/28
CPCH01H50/14H01H50/28H01H50/12
Inventor 筒井和广和地秀幸
Owner ORMON CORP
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