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Method and apparatus for producing board and a board product

A product and cardboard technology, applied in paper/cardboard layered products, layered products, chemical instruments and methods, etc., can solve the problems of high investment cost, clumsy, expensive corrugated cardboard production lines, etc., to achieve high production cost-effectiveness ratio, High strength and bending resistance, large volume effect

Inactive Publication Date: 2004-01-21
AVENIRA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of application does not guarantee an even bond
Two-step manufacturing techniques are expensive and corrugated board lines become long and unwieldy, thus requiring large infrastructure and involving high investment costs

Method used

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  • Method and apparatus for producing board and a board product
  • Method and apparatus for producing board and a board product

Examples

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Comparison scheme
Effect test

Embodiment Construction

[0018] The example shown in the figure is suitable for the manufacture of three-layer products. To produce such a three-layer product, three coils 4 , 5 , 6 are required, which are fed into the process as coils 1 , 2 , 3 . As this process requires, rolls are paid out from the material rolls 1, 2, 3 and enter a bonding / sizing nip 7 formed between two opposing rolls. The rolls are glued together in the nip 7 . First, the interlayer roll 5 is passed through the nip of an embossing roll 8 which embosses a raised pattern thereon by embossing the web 5 in a dry state, thereby permanently deforming the web surface. In this context dry rolls have to be understood as having the normal moisture content of rolls being paid out from storage rolls or processing rolls 2, ie the moisture content of the delivered coils, generally less than 10% and usually 3%-12%. Additionally, the embossing operation is performed without subjecting the web to heat or steam. Most advantageously, the roll su...

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Abstract

A method is disclosed for producing a multilayer paperboard product, as well as an assembly suited for implementing the method and a paperboard manufactured according to the method, whereby the paperboard is made from at least two, advantageously three layers (4, 5, 6) bonded to each other by gluing, and the material of the middle layer (5) is subjected to mechanical working in a dry state (8) so as to deform the material prior to gluing through pressing thereon desired pattern that is raised from the surface of the material (5). The layers (4, 5, 6) are bonded to each other in a single step (7). The method is capable of providing a strong paperboard that uses less fiber than prior-art paperboards of equal thickness and strength.

Description

technical field [0001] The invention relates to a method for producing multi-ply paperboard according to the preamble of claim 1 . [0002] The invention also relates to a device suitable for carrying out the method and to a cardboard product manufactured according to the invention. Background technique [0003] Paperboard is used for printing and its most common application is in various types of packaging. Important material properties required for packaging board grades are high strength and rigidity, and a printing substrate of sufficient quality if text or images are to be printed on the packaging. If cardboards are used eg for packaging liquids or products containing volatile ingredients such as coffee or other food products, they are also often equipped with a barrier layer. The surface quality of the printed substrate is determined by the set requirements for the quality of product packaging printing, so luxury products obviously have to be packaged in different ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B31F1/07B31F1/20B31F1/28B31F5/04B32B29/08
CPCB31F5/04B32B29/08B31F1/20Y10T156/1023Y10T156/1741Y10T428/24479Y10T428/31993
Inventor J·马蒂拉H·苏克斯
Owner AVENIRA
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