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Method and device for washing base plate

A technology for cleaning devices and substrates, applied in cleaning methods and appliances, cleaning methods using liquids, chemical instruments and methods, etc., can solve the problems of reduced production capacity, uneven cleaning, etc., and achieve the effect of inhibiting the increase of cleaning time

Inactive Publication Date: 2003-09-24
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In view of the above reasons, the object of the present invention is to achieve substrate cleaning capable of preventing reduction in productivity and device damage and achieving a high foreign matter removal rate by overcoming the disadvantages of conventional substrate cleaning that only focused on cleaning unevenness.

Method used

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  • Method and device for washing base plate
  • Method and device for washing base plate
  • Method and device for washing base plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0066] The substrate cleaning method and cleaning apparatus according to Embodiment 1 of the present invention will be described below with reference to the drawings.

[0067] figure 1 It is a diagram schematically showing the cleaning device of Example 1, specifically, a cross-sectional structure of an ultrasonic cleaning device that cleans the surface of a substrate by supplying a cleaning liquid to which ultrasonic vibrations are applied.

[0068] Such as figure 1As shown, the substrate 1 is sucked and held by the holding part (specifically, a vacuum chuck) 2 . The vacuum chuck 2 is rotationally driven by a motor 3 . The substrate 1 , the vacuum chuck 2 and the motor 3 are accommodated in a cup body (cover) 4 which is open at the top. A nozzle holder 5 is arranged outside the cup body 4 . The front end portion of the nozzle holder 5 is positioned above the substrate 1 inside the cup body 4 . Further, an ultrasonic nozzle 6 that ejects a cleaning liquid such as pure w...

Embodiment 2

[0091] The substrate cleaning method and cleaning apparatus according to Embodiment 2 of the present invention will be described below with reference to the accompanying drawings.

[0092] Figure 9 It is a diagram schematically showing the cleaning device of Example 2, specifically, a cross-sectional structure of an ultrasonic cleaning device that cleans the surface of a substrate by supplying a cleaning liquid to which ultrasonic vibrations are applied. and in Figure 9 , by pairing with figure 1 Components that are the same as those in the cleaning device of the first embodiment shown are given the same reference numerals, and description thereof will be omitted.

[0093] Such as Figure 9 Shown, the cleaning device of the present embodiment and figure 1 The difference between the cleaning apparatus of the first embodiment shown is that a fixed nozzle 20 for supplying cleaning liquid to the center of the substrate 1 is arranged outside the cup body 4 outside the ultra...

Embodiment 3

[0102] The substrate cleaning method and cleaning apparatus according to Embodiment 3 of the present invention will be described below with reference to the accompanying drawings.

[0103] And, the basic structure of the cleaning device of the present embodiment and the cleaning sequence are the same as the basic structure of the cleaning device of Embodiment 1 (refer to figure 1 ) and cleaning sequence (see image 3 ) are the same, so the description is omitted.

[0104] Figure 12 It is a plan view schematically showing the scanning range of the ultrasonic nozzle 6 (hereinafter referred to as the nozzle scanning range) in the ultrasonic cleaning device of this embodiment.

[0105] Such as Figure 12 As shown, the nozzle scanning range of this embodiment is the same as figure 2 The differences in the nozzle scanning ranges of the shown embodiment 1 are as follows. That is, if figure 2 As shown, the nozzle scanning range 9 of Embodiment 1 is set in the radial directio...

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Abstract

A substrate cleaning method and cleaning device, in which the substrate being ultrasonically cleaned is rotated at a speed of 2600 rpm or more and 3500 rpm or less. The substrate cleaning method and cleaning device can realize substrate cleaning that prevents production capacity from being reduced and device damage, and that can achieve a high foreign matter removal rate.

Description

technical field [0001] The present invention relates to a substrate cleaning method and a cleaning device for cleaning a substrate without contacting the substrate surface with a brush or the like by supplying a cleaning liquid to which ultrasonic waves are applied. Background technique [0002] In order to clean the surface of the substrate, a physical cleaning method is employed in which a cleaning solution such as pure water to which ultrasonic vibrations are applied is supplied to the surface of the substrate. This cleaning method is a method utilizing cavatation, and is mainly used in a process where chemical cleaning cannot be performed, such as a cleaning process after forming metal wiring. [0003] As the miniaturization of electronic devices progresses, in order to remove even finer foreign matter or to clean the device without damage, a device that applies a few megahertz of high-frequency ultrasonic waves to the cleaning liquid and cleans it has been developed or ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B3/02H01L21/00H01L21/306
CPCB08B3/02B08B2203/0288H01L21/02052H01L21/67051Y10S438/906
Inventor 出口康之
Owner PANASONIC CORP
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