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Method for producing optical element and optical element wafer

A technology of optical components and wafers, which is applied in the direction of polarizing components, optical head manufacturing, optical recording heads, etc., and can solve problems such as optical film peeling

Inactive Publication Date: 2007-08-22
TOMOEGAWA PAPER CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

During the thermal cycle test after the electronic device is manufactured, the air between the cover and the optical film will expand, and there is a risk that the optical film will be peeled off from the cover

Method used

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  • Method for producing optical element and optical element wafer
  • Method for producing optical element and optical element wafer
  • Method for producing optical element and optical element wafer

Examples

Experimental program
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Embodiment Construction

[0036] Hereinafter, the present invention will be described in detail.

[0037] (Optical element)

[0038] The optical element of the present invention is an element in which an optical film is attached to a substrate, and is characterized in that the optical film is only partially formed.

[0039] As a specific configuration example of the optical element of the present invention, as shown in FIG. The sticking position of the optical film 51 on the base 31 is not limited to the central portion of the base 31 , as shown in FIG. 1( b ), the optical film 51 may be attached to the end of the base 31 . As shown in FIG. 1( c ), it is also possible to form a structure in which a plurality of optical films 51 are attached.

[0040] As other configuration example shown in Fig. 1 (d) and (e), can enumerate following configuration: place all sticks optical thin film 51 except the four jiaos of substrate 31, as shown in Fig. 1 (f), An optical film is attached to all but one corner of ...

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PUM

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Abstract

The invention provides a method for producing optical elements. The method comprises the following steps of: dividing a base material of an optical film into a plurality of optical films, removing sections free of optical films from the base material of the optical film, dividing a substrate into a plurality of substrates, adhering each optical film onto each substrate to form a plurality of optical elements, and taking out the optical elements.

Description

[0001] This application is a divisional application of No. 03142318.3 patent application for invention. technical field [0002] The present invention relates to an optical element bonded to a housing body for accommodating electronic components, an optical element wafer capable of manufacturing, storing, and transporting a plurality of optical elements in batches, and a corresponding manufacturing method. Background technique [0003] Conventionally, after accommodating various electronic components in a box-shaped case main body having an opening, a cover for sealing the electronic device (hereinafter, sometimes simply referred to as a "cover") is connected to the opening side end of the case main body. Part bonding, electronic components are accommodated in the case composed of the case body and the cover, and various electronic devices are manufactured. Such an electronic device is used, for example, as a device for an optical pickup or the like. [0004] In recent year...

Claims

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Application Information

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IPC IPC(8): G02B5/30G11B7/22
Inventor 手塚明相川文则土田雅之驹形文规
Owner TOMOEGAWA PAPER CO LTD
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