Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for determining self-punching riveting process parameters, electronic equipment and storage medium

A technology for determining process parameters and methods, applied in design optimization/simulation, special data processing applications, machine learning, etc., can solve problems such as consumption, large manpower and material resources

Active Publication Date: 2022-07-22
SHENZHEN POLYTECHNIC
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the problem of consuming a lot of manpower and material resources in the related technology of determining the process parameters of self-piercing riveting, the embodiment of the present invention provides a method, device, electronic equipment and storage medium for determining the process parameters of self-piercing riveting

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for determining self-punching riveting process parameters, electronic equipment and storage medium
  • Method and device for determining self-punching riveting process parameters, electronic equipment and storage medium
  • Method and device for determining self-punching riveting process parameters, electronic equipment and storage medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work are protected by the present invention. scope.

[0033] Please refer to figure 1 , an embodiment of the present invention provides a method for determining process parameters of self-piercing riveting, the method comprising:

[0034] Step 100: Obtain the sheet parameters of the sheet to be riveted;

[0035] Step 102: call the pre-trained process parameter determination model; wherein, the pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the invention relates to the technical field of self-punching riveting, in particular to a method and device for determining self-punching riveting process parameters, electronic equipment and a storage medium. Specifically, the method comprises the steps that plate parameters of a to-be-riveted plate are obtained; calling a pre-trained process parameter determination model; wherein the process parameter determination model is obtained by training sample plate parameters and sample process parameters; and inputting the plate parameters into the process parameter determination model, and determining process parameters for carrying out self-punching riveting on the to-be-riveted plate. According to the technical scheme provided by the invention, the process parameter determination model is set, so that the plate parameters of the to-be-riveted plate can be input into the process parameter determination model in the self-punching riveting process to obtain the process parameters for carrying out self-punching riveting on the to-be-riveted plate; therefore, a large number of trial and error experiments need to be carried out before self-punching riveting can be avoided, and the problem that a large number of manpower and material resources are consumed in related technologies for determining self-punching riveting process parameters is solved.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of self-piercing riveting, and in particular, to a method, device, electronic device and storage medium for determining process parameters of self-piercing riveting. Background technique [0002] Self-piercing riveting (ie, self-piercing riveting) is an emerging connection technology, which is widely used in aviation, aerospace, automobile and ship fields. Compared with traditional threaded connection, riveting and welding, it has the and other advantages. The process of self-piercing riveting is roughly as follows: under the action of the punch, the semi-hollow rivet is pressed into the plate fixed on the mold, so that the rivet pierces the upper plate without piercing the lower plate; under the action of the punch and the mold , so that the legs of the semi-hollow rivet are opened around to form a firm mechanical inner lock to realize the connection between the upper plate and the lo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F30/17G06F30/27G06N20/00B21J15/04
CPCG06F30/17G06F30/27G06N20/00B21J15/04
Inventor 赵伦林森龚涛陈伟张亮甘增康霍小乐罗义
Owner SHENZHEN POLYTECHNIC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products