Device and method for removing pollution particles on mask plate

A technology of polluting particles and reticles, which is applied in the field of semiconductor integrated circuits, can solve problems such as the inability to accurately locate the specific location of polluting particles and secondary pollution of reticles, so as to avoid secondary pollution, reduce multiple unpacking processes, and reduce The effect of the probability of return to the factory for laundering

Pending Publication Date: 2022-06-24
SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The manual box opener 100 has an open structure; the open structure will directly expose the reticle to the external environment, and it is impossible to accurately locate the ...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Device and method for removing pollution particles on mask plate
  • Device and method for removing pollution particles on mask plate
  • Device and method for removing pollution particles on mask plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] like figure 2 As shown, it is a schematic diagram of the external structure of the device for removing the contamination particles 207 on the reticle 208 according to the embodiment of the present invention; image 3 As shown, it is the first grid diagram formed by the grid-type light source of the astigmatism lamp 201 according to the embodiment of the present invention corresponding to the division of the reticle 208; such as Figure 4 shown is the second grid map formed by dividing the pollution particle distribution map according to the embodiment of the present invention; such as Figure 5 As shown, it is a schematic diagram of the internal structure of the device for removing the pollution particles 207 on the reticle 208 according to the embodiment of the present invention when removing the pollution particles 207; the device for removing the pollution particles 207 on the reticle 208 according to the embodiment of the present invention is provided with an illum...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a device for removing pollution particles on a mask plate. The device is provided with an illuminating lamp group; the illuminating lamp group comprises a floodlight with a grid-type light source and a spotlight; after the floodlight is turned on, the grid type light source irradiates the mask plate and divides the mask plate into a plurality of first grids, and coarse positioning of pollution particles on the mask plate is achieved through the first grids; and after being turned on, the spotlight is used for irradiating the first grid corresponding to the coarse positioning and realizing the fine positioning of the pollution particles, and the rapid removal of the pollution particles is realized through the fine positioning. The invention further discloses a method for removing the pollution particles on the mask plate. According to the invention, pollution particles on the mask plate can be rapidly positioned, so that the pollution particles on the mask plate can be accurately and rapidly removed, the efficiency of removing the pollution particles is improved, secondary pollution can be avoided, and the probability of repeatedly opening a box of the mask plate and returning the mask plate to a factory for washing is reduced.

Description

technical field [0001] The present invention relates to the field of semiconductor integrated circuits, in particular to a device for removing contamination particles on a mask. The invention also relates to a method for removing contaminating particles on a mask. Background technique [0002] Among a series of processes in semiconductor manufacturing, lithography is a key process in integrated circuit manufacturing. Photolithography is the use of photochemical reaction, through the wafer surface primer, spin coating photoresist, soft baking, alignment, exposure, post-baking, development, hard baking, detection and other processes to transfer the pattern prepared in advance on the reticle. onto the photoresist film, enabling subsequent selective etching and ion implantation. As an indispensable part of the photolithography exposure process, the reticle plays a crucial role in the formation of patterns on the photoresist film. Once foreign particles fall on the reticle, it...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): G03F7/20
CPCG03F7/70908G03F7/7085
Inventor 詹海娇
Owner SHANGHAI HUALI INTEGRATED CIRCUTE MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap