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Computer heat dissipation cooling system

A cooling and computer technology, applied in computing, energy-saving computing, climate sustainability and other directions, can solve the problems of small size, inability to achieve the cooling effect of the computer box, and the temperature of the computer motherboard, so as to improve air flow, improve Solid conduction heat dissipation efficiency, the effect of improving the appearance of aesthetics

Pending Publication Date: 2022-05-27
北京安德兴石油技术有限公司
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Problems solved by technology

[0009] With the development of science and technology and the application of semiconductor materials, computer chips are now smaller in size and higher in performance. Computer motherboards are components for the main new performance structures of computers. The temperature of the motherboard will rise significantly, and it may not be possible to achieve a better heat dissipation effect in the computer case by only installing a radiator

Method used

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  • Computer heat dissipation cooling system
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Embodiment Construction

[0033] Combine below Figure 1-7The present invention is described in detail, wherein, for the convenience of description, the orientations mentioned below are now defined as follows: figure 1 The projection relationship of itself is the same as the up, down, left, right, front, and rear directions.

[0034] combined with Figure 1-7 The described computer cooling system includes a chassis 11, the chassis 11 is provided with an inner recess 12, a mainboard mounting device 20 is installed in the chassis 11, the mainboard mounting device 20 includes a mainboard mounting plate 30, and the mainboard mounting plate 30 is provided with protrusions. The flat part 25 and the raised flat part 25 are provided with hollow heat dissipation grooves 28 in an array; the raised flat part 25 is provided with a thermally conductive metal block 27 in the array; On the mounting plate 30, the other side of the raised flat part 25 is placed in the functional heat dissipation groove 31, the inner ...

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Abstract

The invention relates to the related technical field of computer heat dissipation, and discloses a computer heat dissipation cooling system which comprises a case, the case is provided with an inner concave part, a mainboard carrying device is installed in the case, the mainboard carrying device comprises a mainboard installation plate, the mainboard installation plate is provided with a protruding plane part, and the protruding plane part is connected with the mainboard installation plate. Hollow heat dissipation grooves are formed in the convex plane part in an array mode, heat conduction metal blocks are arranged on the convex plane part in an array mode, functional heat dissipation grooves are formed in the inner side of the convex plane part, and the convex plane part penetrates through the mainboard mounting plate; according to the computer heat dissipation and cooling system, through the arrangement of efficient heat dissipation and cooling functions and the arrangement of the protruding plane parts and the functional heat dissipation groove internal structures, a certain space can be formed in the erecting position of the mainboard relative to the inner wall of the computer case, and therefore the air flowing efficiency of the peripheral side of the mainboard can be greatly improved; and the heat conduction metal block can be attached to the mainboard for heat conduction, so that solid conduction heat dissipation of the temperature of the mainboard is realized.

Description

technical field [0001] The invention relates to the related technical field of computer heat dissipation, in particular to a computer heat dissipation cooling system. Background technique [0002] A large number of integrated circuits are used in computer components. As we all know, the heat that causes high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. Most radiators absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distance through various methods, such as the air in the chassis, and then the chassis transmits the hot air to the outside of the chassis to complete the cooling of the computer. [0003] At present, the most common computer heat dissipation is air-cooled heat dissipation, and the most common device for air-cooled heat dissipation is the cooling fan. The existing traditional technology is not fully considered, and has the following disadvanta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201Y02D10/00
Inventor 刘达
Owner 北京安德兴石油技术有限公司
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