Dispensing, assembling and synthesizing device for automobile integrated circuit board chip
A technology for an integrated circuit board and a synthesis device, which is applied in the field of automotive integrated circuit board chip dispensing and assembly synthesis device, can solve the problem that the dispensing success rate is not high, the product qualification rate is low, and the integrated circuit board and the chip cannot be well fixed. And other issues
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Embodiment 1
[0080] An automobile integrated circuit board chip dispensing assembly synthesis device, such as Figure 1-6 As shown, it includes a connection frame 1, a protective frame 101, a revolving door 102, a revolving assembly 103, a connecting frame 104, a glue dispensing assembly 105, an integrated circuit board 106, a chip 107, a guide wheel assembly 108, a glue dispensing switch mechanism 2 and installation Mechanism 3, connecting frame 1 top middle rear part is provided with protection frame 101, and protection frame 101 top left and right sides all are provided with rotating assembly 103 symmetrically front and back, between two rotating assemblies 103 on the same side are all provided with revolving door 102, two Each revolving door 102 is all in contact with the protective frame 101, and the middle front side of the top of the connecting frame 1 is symmetrically provided with connecting frames 104, and the two connecting frames 104 are all located inside the protective frame 1...
Embodiment 2
[0087] On the basis of Example 1, such as figure 2 , Figure 7-14 As shown, a pusher mechanism 4 is also included, and the pusher mechanism 4 includes a fourth fixed shaft 41, a pusher plate 42 and a third spring 43, and the fourth fixed shaft 41 is symmetrically arranged on the top front of the connection frame 1. Between the two fourth fixed shafts 41 and the connecting frame 1, a pusher plate 42 is slidably arranged, and a third spring 43 is wound on the fourth fixed shaft 41. The four fixed shafts 41 are connected with the pushing plate 42 .
[0088] When it is necessary to dispense glue to the integrated circuit board 106 and the chip 107, people first place the integrated circuit board 106 on the front side of the top of the connection frame 1, and then push the pushing plate 42 backwards, so that the third spring 43 is compressed, so that the pushing The material plate 42 drives the integrated circuit board 106 to move backward to the bottom of the glue dropping asse...
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