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Fixture and method for detecting full-size position of whole substrate product

A technology for detecting fixtures and substrates, applied in the field of solder printing, can solve the problems of unguaranteed accuracy and damage to the entire substrate product, and achieve the effect of convenient material retrieval.

Pending Publication Date: 2022-03-25
华天科技(南京)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the existing technology, when inspecting and locating the entire substrate product, the worker holds the substrate in his hand and observes it under the light. This method is likely to cause damage to the entire substrate product, and at the same time, the accuracy of the inspection cannot be guaranteed.

Method used

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  • Fixture and method for detecting full-size position of whole substrate product
  • Fixture and method for detecting full-size position of whole substrate product
  • Fixture and method for detecting full-size position of whole substrate product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A fixture for detecting the size and position of a whole substrate product, comprising a detection base 7 and a detection cover 8, the detection cover 8 is arranged above the detection base 7, and the detection cover 8 is provided with a plurality of foot points 9, characters 11 and several detection holes 10, the characters 11 and the first foot point 9 have the same number, each character 11 and a first foot point 9 correspond to a group, and each group of characters 11 and the first foot point 9 corresponds to a detection hole 10 .

[0033] The detection base 7 is rectangular, and the detection base 7 is provided with four grooves 3, and each long side of the detection base 7 is provided with 2 grooves 3, and the grooves 3 on the two long sides are mutually symmetrical, and the grooves 3 is used to take away the entire substrate product from the groove 3 after the inspection is completed.

[0034] Four screws 1 are uniformly arranged around the detection base 7 to f...

Embodiment 2

[0044] A method for detecting the size and position of a whole substrate product, based on a jig for detecting the size and position of a whole substrate product in Embodiment 1, comprising the following steps:

[0045] Firstly, put the entire substrate product on the detection base 7, and cover the detection cover plate 8; make the concave first positioning pin 2 and the convex second positioning pin 5 cooperate;

[0046] Secondly, stick the positioning pin 6 on the positioning hole of the entire substrate product for positioning adjustment until the first foot point 9 is aligned with the reference first foot point on the entire substrate product;

[0047] Then, observe from the detection hole 10 whether the printing area on the entire substrate product is offset;

[0048] Finally, when the detection is completed, the detection cover 8 is removed, and the entire printed substrate product is removed from the groove 3 .

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Abstract

The invention belongs to the technical field of soldering tin printing, and particularly relates to a whole substrate product size and position detection clamp and method.The whole substrate product size and position detection clamp comprises a detection base and a detection cover plate, the detection cover plate is arranged above the detection base, the detection cover plate is provided with a plurality of one-pin points, characters and a plurality of detection holes, and the characters and the one-pin points are the same in number; each character and one foot point are correspondingly grouped, and each group of characters and one foot point correspond to one detection hole. According to the invention, the confirmation of the printing position of the whole substrate product is provided, and the detection holes, the pin points and the characters which are in one-to-one correspondence are arranged on the detection cover plate, so that the problem that the existing offset needs to be confirmed after being cut is solved.

Description

technical field [0001] The invention belongs to the technical field of solder printing, and in particular relates to a jig and method for detecting the size and position of an entire substrate product. Background technique [0002] In the existing technology, when inspecting and locating the entire substrate product, the worker holds the substrate in his hand and observes it under the light. This method is likely to cause damage to the entire substrate product, and at the same time, the accuracy of the inspection cannot be guaranteed. . For this reason, a fixture for detecting the full-scale position of the entire substrate product before cutting is needed, so as to accurately clamp and control the full-scale position offset of the substrate product Mark. Contents of the invention [0003] The purpose of the present invention is to provide a fixture and method for detecting the size and position of the entire substrate product, which is used to detect the full-scale posit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B5/00G01B11/02
CPCG01B5/00G01B5/0007G01B11/02
Inventor 王雨露
Owner 华天科技(南京)有限公司
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