Chip stripping mechanism, stripping machine and stripping method

A peeling mechanism and peeling machine technology, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems of waste costs of chemicals, unsatisfactory production, strong chip damage, etc., to reduce chip damage rate, Reduction of tool replacement time and improvement of production efficiency

Active Publication Date: 2022-05-03
HEFEI SMAT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The former method requires too many chemicals to waste costs. Although the latter method of stripping can be stripped by using the existing stripping machine, it is highly destructive to the chip and causes a high probability of damage to the packaging layer. The above two conventional methods The method is actually not ideal in production

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  • Chip stripping mechanism, stripping machine and stripping method
  • Chip stripping mechanism, stripping machine and stripping method
  • Chip stripping mechanism, stripping machine and stripping method

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Embodiment Construction

[0023] In order to better understand the purpose, structure and function of the present invention, below in conjunction with appendix Figure 1-5 , a chip stripping mechanism, stripping machine and stripping method proposed by the present invention will be further described in detail.

[0024] Conventional technology uses chemical and physical methods to separate the UV film from the chip 4 , but in actual production there are problems such as wasting the cost of dissolving chemicals and seriously damaging the chip 4 by peeling off. And a kind of chip stripping mechanism of the present invention, not only does not need degumming, can also reduce the damage rate of chip 4 when peeling off, and its structure comprises the telescopic manipulator 2 that will be installed with the carrier film 3 of chip 4 clamping position, can The telescopic manipulator 2 can be clamped and positioned by using a conventional industrial programming robot arm, mainly because it also includes the ads...

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Abstract

The invention discloses a chip peeling mechanism, a peeling machine and a peeling method, which include a retractable manipulator for clamping and positioning a carrier film with a chip installed thereon, and an adsorption device; after the chip to be peeled moves to the top of the adsorption device, After the adsorption device generates negative pressure, it absorbs the chip to be peeled off on the carrier film, and then, the retractable manipulator moves in the opposite direction of the adsorption device to pump air, and peels off the chip and the carrier film. The method of peeling off the chip and the UV film in this design is fast and convenient, not only does not need to be unglued, but also reduces the damage rate of the chip during peeling, the peeling efficiency is high, and the cost is saved.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging, and in particular relates to a chip peeling mechanism, a peeling machine and a peeling method. Background technique [0002] In the packaging process of chip processing, among them, after the finished product cutting step, it is necessary to peel off the UV film carrying multiple chips, and peel off the chip unit and the UV film. There are often two types in the prior art. Common methods, the first way is to use the degumming machine to degumming between the chip and the UV film, using chemical means to degumming and separating; the second way is to use the structure of the physical means of the peeling machine to degumming the chips on the production line. And UV film peeling. The former method requires too many chemicals to waste costs. Although the latter method of stripping can be stripped by using the existing stripping machine, it is highly destructive to the chip and cause...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/67
CPCH01L21/67126H01L21/6838
Inventor 谭小春
Owner HEFEI SMAT TECH CO LTD
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