Silicon wafer material box device

A silicon wafer and material box technology, which is applied in transportation and packaging, conveyor objects, electrical components, etc., can solve the problems of high defect rate, high silicon wafer fragmentation rate, and many cracks, so as to save cost and reduce loss rate. , the effect of reducing crack loss

Pending Publication Date: 2021-12-10
南京卓胜自动化设备有限公司
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Purpose of the invention: To provide a silicon wafer box that can solve the problems of high fragmentation rate, many hidden cracks, and high defect rate of silicon wafers caused by friction between the side of the silicon wafer and the rib of the silicon wafer box mechanism during the wafer taking process device

Method used

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  • Silicon wafer material box device
  • Silicon wafer material box device
  • Silicon wafer material box device

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Embodiment Construction

[0025] The technical solutions provided by the present invention will be described in detail below in conjunction with the accompanying drawings.

[0026] Such as image 3 As shown, the silicon wafer magazine device includes a bottom plate 110 and a plurality of trays 130 arranged on the bottom plate 110, and also includes a plurality of edge retaining mechanisms 1, and the plurality of edge retaining mechanisms 1 are respectively located around the tray 130. A tray 130 is loaded with silicon wafers. Each edge retaining mechanism 1 comprises a lower guide column 2, an upper guide column 3, a conveyor belt 4, a first pulley 5, and a second pulley 6, wherein the lower guide column 2 is connected with the base plate 110, and the upper guide column 3 is connected with the lower guide post 2 by slipping, the first pulley 5 is set on the lower guide post 2, the second pulley 6 is set on the upper guide post 3, the conveyor belt 4 is connected with the first pulley 5 and the second ...

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PUM

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Abstract

The invention provides a silicon wafer material box device, which comprises a bottom plate and a plurality of trays arranged on the bottom plate, and further comprises a plurality of flange mechanisms, wherein the flange mechanisms are located on the peripheries of the trays respectively, each flange mechanism comprises a lower guide column, an upper guide column and a conveying belt, each lower guide column is arranged on the bottom plate and extends upwards, the lower end of each upper guide column is connected with the upper end of the corresponding lower guide column in a sliding fit mode, the extending direction of each upper guide column is consistent with the extending direction of the corresponding lower guide column, a first belt wheel is arranged at the lower end of the lower guide column, a second belt wheel is arranged at the upper end of the upper guide column, each conveying belt is matched with the first belt wheel and the second belt wheel in the same direction, the tray is provided with a side edge parallel to the conveying belt, and the conveying belt and the side edge of the tray are connected in a locked mode to operate synchronously.

Description

technical field [0001] The invention relates to the technical field of solar cell manufacturing, in particular to a silicon wafer magazine device. Background technique [0002] Such as figure 1 and figure 2 As shown, the existing silicon wafer magazine device includes a wafer magazine mechanism 100, a jacking mechanism 200, a suction cup 300, and a conveyor 400. The silicon wafer magazine mechanism 100 includes a bottom plate 110, a sidewall 120 and a tray 130, wherein the sidewall 120 protrudes from the bottom plate 110 and is located around the tray 130. The tray 130 is used to carry a plurality of silicon wafers; 200 lifts the tray 130 upwards, the tray 130 holds up the silicon wafers, the silicon wafers are sucked by the suction cup 300, and the silicon wafers are sucked onto the conveyor 400; this process reciprocates, and the silicon wafers in the existing silicon wafer material box device Take them in turn. [0003] However, in the existing silicon wafer material...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/673H01L21/677
CPCH01L21/67333H01L21/67766H01L21/67781
Inventor 王志刚蒋旭东张弛顾建蒋成斌
Owner 南京卓胜自动化设备有限公司
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