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5G high-frequency microwave copper-clad plate continuous packaging device and using method

A high-frequency microwave and copper clad laminate technology, applied in the field of 5G high-frequency microwave copper clad laminate continuous packaging devices, can solve the problems of low manufacturing efficiency, decline in the quality of copper clad laminates, poor screening effect, etc., to improve efficiency, improve accuracy, Guaranteed accuracy

Inactive Publication Date: 2021-11-30
重庆永玖志兆科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides a 5G high-frequency microwave continuous packaging device for copper-clad laminates, which is used to solve the problem of low manufacturing efficiency due to manual selection and screening of raw materials when manufacturing copper-clad laminates in the prior art. And the screening effect is poor, which leads to the problem of the decline in the quality of copper clad laminates

Method used

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  • 5G high-frequency microwave copper-clad plate continuous packaging device and using method
  • 5G high-frequency microwave copper-clad plate continuous packaging device and using method
  • 5G high-frequency microwave copper-clad plate continuous packaging device and using method

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Embodiment 1

[0069] Such as Figure 1-10 As shown, a 5G high-frequency microwave continuous packaging device for copper-clad laminates, including a material sorting device A, a material delivery device B, and the left part of the material sorting device A is fixedly connected to the material delivery device B;

[0070] The material sorting device A includes a material sorting tray A1 and a material sorting component A2, and the material sorting component A2 is arranged above the material sorting tray A1. The copper clad laminate raw materials arrive at the packing station under the action of the conveying mechanism, where packing personnel are specially arranged to manually push the packing box into the packing machine for packing, and then push the packed packing box into the next conveying mechanism. Since the packaging process is intermittent, the packaging box must be manually pushed in when entering the packaging machine. The conveying mechanism in the prior art cannot connect its own...

Embodiment 2

[0075] This embodiment is a further improvement of the previous embodiment, such as Figure 1-10 As shown, a 5G high-frequency microwave continuous packaging device for copper-clad laminates, including a material sorting device A, a material conveying device B, and the left part of the material sorting device A is fixedly connected to the material conveying device B;

[0076] The material sorting device A includes a material sorting tray A1 and a material sorting component A2, and the material sorting component A2 is arranged above the material sorting tray A1. The copper clad laminate raw material arrives at the packing station under the action of the conveying mechanism, where packing personnel are specially arranged to manually push the packing box into the packing machine for packing, and then push the packed packing box into the next conveying mechanism. Since the packaging process is intermittent, the packaging box must be manually pushed in when entering the packaging m...

Embodiment 3

[0084] This embodiment is a further improvement of the previous embodiment, such as Figure 1-10 As shown, a 5G high-frequency microwave continuous packaging device for copper-clad laminates, including a material sorting device A, a material conveying device B, and the left part of the material sorting device A is fixedly connected to the material conveying device B;

[0085] The material sorting device A includes a material sorting tray A1 and a material sorting component A2, and the material sorting component A2 is arranged above the material sorting tray A1. The copper clad laminate raw material arrives at the packing station under the action of the conveying mechanism, where packing personnel are specially arranged to manually push the packing box into the packing machine for packing, and then push the packed packing box into the next conveying mechanism. Since the packaging process is intermittent, the packaging box must be manually pushed in when entering the packaging m...

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Abstract

The invention belongs to the technical field of copper-clad plate manufacturing, and particularly relates to a 5G high-frequency microwave copper-clad plate continuous packaging device. The 5G high-frequency microwave copper-clad plate continuous packaging device comprises a material sorting device and a material conveying and distributing device, and the left portion of the material sorting device is fixedly connected with the material conveying and distributing device; and the material sorting device comprises a material sorting disc and a material sorting component, the material sorting component is arranged above the material sorting disc, the material sorting disc comprises a sorting disc body, a disc body rotating shaft, a disc body motor and a disc body linkage belt, the disc body rotating shaft is arranged below the sorting disc body, and the top end of the disc body rotating shaft is connected with the center of the sorting disc body. According to the 5G high-frequency microwave copper-clad plate continuous packaging device, the problems that in the prior art, when copper-clad plates are manufactured, the raw material packaging efficiency and packaging quality are low are solved, an automatic continuous packaging and conveying device is achieved, and unmanned continuous automatic packaging is thoroughly achieved. The invention further provides a using method of the 5G high-frequency microwave copper-clad plate continuous packaging device, and aims to improve the production efficiency of the 5G high-frequency microwave copper-clad plates.

Description

technical field [0001] The invention belongs to the technical field of copper-clad laminate manufacturing, and in particular relates to a 5G high-frequency microwave copper-clad laminate continuous packaging device and a use method. Background technique [0002] Copper clad laminate is an extremely important basic material for printed circuit boards. Printed circuit boards of various forms and functions are selectively processed, etched, drilled and copper-plated on copper clad laminates. Different printed circuits (single-sided, double-sided, multilayer). As the substrate material in the manufacture of printed circuit boards, copper clad laminates mainly play the role of interconnection, insulation and support for printed circuit boards, and have a great influence on the transmission speed, energy loss and characteristic impedance of signals in the circuit. Therefore, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost and lon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65B35/26B65B35/16B65B35/18B65B63/00B32B5/02B32B5/26B32B15/20B32B15/14B32B37/06B32B37/10B32B38/08B32B38/00
CPCB65B35/26B65B35/16B65B35/18B65B63/00B32B5/02B32B5/26B32B15/20B32B15/14B32B37/06B32B37/10B32B38/08B32B38/0036B32B2262/101B32B2260/021B32B2260/046B32B2457/08
Inventor 郑传明
Owner 重庆永玖志兆科技有限公司
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