Multilayer printed waterproof circuit board

Abstract

The invention relates to the technical field of circuit board equipment, in particular to a multilayer printing waterproof circuit board which comprises a protection mechanism, the protection mechanism is provided with an installation mechanism and an auxiliary mechanism, the installation mechanism drives the auxiliary mechanism, the protection mechanism is provided with a heat dissipation mechanism, and the heat dissipation mechanism is connected with a contact mechanism. Through the arrangement of the protection mechanism, the sealing and waterproof effects are achieved while the protection effect on the circuit board is achieved; through the arrangement of the mounting mechanism and the auxiliary mechanism, a plurality of circuit boards can be conveniently mounted on the protection mechanism, the internal space of the protection mechanism is reasonably utilized to the greatest extent, the space utilization rate is improved, and the replacement efficiency is improved through the design of convenient disassembly and assembly; and the contact mechanism can be cooled conveniently and quickly through the heat dissipation mechanism, and can be attached to the circuit board conveniently and better through the contact mechanism, so that the temperature of the circuit board can be stabilized in a reasonable range conveniently and quickly.

Description

technical field [0001] The invention relates to the technical field of circuit board equipment, in particular to a multilayer printed waterproof circuit board. Background technique [0002] Among all kinds of electronic equipment, printed circuit boards are currently used as fixed components and connecting circuits. Printed circuit boards are providers of electrical connections for electronic components. The main advantage of using printed circuit boards is that they greatly reduce wiring and assembly errors and improve Improve the level of automation and production efficiency. [0003] However, in order to achieve the waterproof effect of the traditional circuit board, most of the waterproof materials are poured onto the circuit board to achieve the effect, which may easily cause poor heat dissipation of the circuit board and the internal electronic components cannot be repaired and maintained when damaged, and the traditional heat dissipation Generally, the air cooling of...

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Problems solved by technology

[0003] However, in order to achieve the waterproof effect of the traditional circuit board, most of the waterproof materials are poured onto the circuit board to achieve the effect, which may easily cause poor heat dissipation of the circuit board and the internal electronic components cannot be repaired and maintained when damaged, and the traditional heat dissipation Generally, the air cooling of the non-contact heat dissipation part is used for heat dissipation, the heat dissipation effect is poor, and it is not convenient to dissipate heat for multi-layer circuit boards, thus greatly reducing the service life of the circuit boards

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